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[n]	A. T. Wu et al., “Buffered Electropolishing – A New Way for Achieving Extremely Smooth Surface Finish on Nb SRF Cavities to be Used in Particle Accelerators”, in Proc. PAC'09, Vancouver, Canada, May 2009, paper WE5PFP060, pp. 2141-2143. 

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Paper Title: Buffered Electropolishing – A New Way for Achieving Extremely Smooth Surface Finish on Nb SRF Cavities to be Used in Particle Accelerators
Paper URL: https://jacow.org/PAC2009/papers/WE5PFP060.pdf
Conference: 23rd Particle Accelerator Conf. (PAC'09)
Paper ID: WE5PFP060
Location in proceedings: 2141-2143
Original Author String: A.T. Wu, G. Ciovati, JLAB, Newport News, Virginia; F. Eozénou, CEA, Gif-sur-Yvette; S. Jin, L. Lin, X.Y. Lu, PKU/IHIP, Beijing; J. Mammosser, ORNL, Oak Ridge, Tennessee; R. Manus, H.L. Phillips, C.E. Reece, R.A. Rimmer, W. Sommer, H. Tian, JLAB, Newport News, Virginia; E. Wang, PKU/IHIP, Beijing; J.S. Williams, JLAB, Newport News, Virginia

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