[n] D. N. Smithe, D. Karipides, P. Stoltz, G. Cheng, and H. Wang, “Integrated EM & Thermal Simulations with Upgraded VORPAL Software”, in Proc. PAC'11, New York, NY, USA, Mar.-Apr. 2011, paper WEOCS4, pp. 1463-1465.
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Paper Title: Integrated EM & Thermal Simulations with Upgraded VORPAL Software
Paper URL: https://jacow.org/PAC2011/papers/WEOCS4.pdf
Conference: 24th Particle Accelerator Conf. (PAC'11)
Paper ID: WEOCS4
Location in proceedings: 1463-1465
Original Author String: D.N. Smithe, D. Karipides, P. Stoltz [Tech-X, Boulder, Colorado, USA] G. Cheng, H. Wang [JLAB, Newport News, Virginia, USA]