Reference Search

Reference

For Word

[n]	F. Furuta, K. Saito, and H. Yamaoka, “Different Materials Bonding by HIP Technology and the Reliability”, in Proc. SRF'05, Ithaca, NY, USA, Jul. 2005, paper TUP60, pp. 383-383.

For LaTeX

%\cite{Furuta:SRF05-TUP60} \bibitem{Furuta:SRF05-TUP60} F. Furuta, K. Saito, and H. Yamaoka, \textquotedblleft{Different Materials Bonding by HIP Technology and the Reliability}\textquotedblright, in \emph{Proc. SRF’05}, Ithaca, NY, USA, Jul. 2005, paper TUP60, pp. 383--383.

For BibTeX

@inproceedings{furuta:srf05-tup60, author = {F. Furuta and K. Saito and H. Yamaoka}, title = {{Different Materials Bonding by HIP Technology and the Reliability}}, booktitle = {Proc. SRF'05}, pages = {383--383}, paper = {TUP60}, venue = {Ithaca, NY, USA, Jul. 2005}, publisher = {JACoW Publishing, Geneva, Switzerland}, url = {https://jacow.org/SRF2005/papers/TUP60.pdf}, language = {english} }

Use Complete Form

Metadata

Paper Title: Different Materials Bonding by HIP Technology and the Reliability
Paper URL: https://jacow.org/SRF2005/papers/TUP60.pdf
Conference: 12th Int. Conf. RF Superconductivity (SRF'05)
Paper ID: TUP60
Location in proceedings: 383-383
Original Author String: F. Furuta, K. Saito, H. Yamaoka, KEK, Ibaraki

Associated Authors

Back to the list