JaCoW Logo

Reference Search

Reference


For Word

[n]	L. P. Sun et al., “The Analysis of Module Failure in High Solid-state Amplifier for High Current RFQ”, in Proc. LINAC'18, Beijing, China, Sep. 2018, pp. 886-888. doi:10.18429/JACoW-LINAC2018-THPO090

For LaTeX

For BibTeX

Use Complete Form

Metadata

Paper Title: The Analysis of Module Failure in High Solid-state Amplifier for High Current RFQ
Paper URL: https://jacow.org/linac2018/papers/THPO090.pdf
Conference: 29th Linear Accelerator Conf. (LINAC'18)
Paper ID: THPO090
Location in proceedings: 886-888
Original Author String: L.P. Sun, Y. He, G. Huang, C.X. Li, L. Lu, A. Shi, L.B. Shi, X.B. Xu, H.W. Zhao [IMP/CAS, Lanzhou, People's Republic of China]

Associated Authors


Back to the list