[n] J. Sauza-Bedolla et al., “Preserving Micron Tolerances Through the Assembly Process of an X-band Accelerating Structure”, in Proc. LINAC'18, Beijing, China, Sep. 2018, pp. 377-379. doi:10.18429/JACoW-LINAC2018-TUPO023
Use Complete Form
Paper Title: Preserving Micron Tolerances Through the Assembly Process of an X-band Accelerating Structure
Paper URL: https://jacow.org/linac2018/papers/TUPO023.pdf
Conference: 29th Linear Accelerator Conf. (LINAC'18)
Paper ID: TUPO023
Location in proceedings: 377-379
Original Author String: J. Sauza-Bedolla, N. Catalan-Lasheras (N. Catal?ín Lasheras), A. Grudiev, S. Lebet, E. Rodriguez-Castro, P. Sobrino-Mompean, A. Solodko, K. T. Szypula [CERN, Geneva, Switzerland] H. Bursali [IZTECH, Izmir, Turkey]