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[n]	T. T. Arkan et al., “LCLS-II 1.3 GHz Design Integration for Assembly and Cryomodule Assembly Facility Readiness at Fermilab”, in Proc. SRF'15, Whistler, Canada, Sep. 2015, paper TUPB110, pp. 893-897. 

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Paper Title: LCLS-II 1.3 GHz Design Integration for Assembly and Cryomodule Assembly Facility Readiness at Fermilab
Paper URL: https://jacow.org/SRF2015/papers/TUPB110.pdf
Conference: 17th Int. Conf. RF Superconductivity (SRF'15)
Paper ID: TUPB110
Location in proceedings: 893-897
Original Author String: T.T. Arkan, C.M. Ginsburg, Y. He, J.A. Kaluzny, Y.O. Orlov, T.J. Peterson, K. Premo [Fermilab, Batavia, Illinois, USA]

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