[n] E. Kako et al., “Quality Control of Copper Plating in STF-2 Input Power Couplers”, in Proc. SRF'17, Lanzhou, China, Jul. 2017, pp. 186-190. doi:10.18429/JACoW-SRF2017-MOPB061
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Paper Title: Quality Control of Copper Plating in STF-2 Input Power Couplers
Paper URL: https://jacow.org/srf2017/papers/MOPB061.pdf
Conference: 18th Int. Conf. RF Superconductivity (SRF'17)
Paper ID: MOPB061
Location in proceedings: 186-190
Original Author String: E. Kako, R. Ueki [KEK, Ibaraki, Japan] K. Hiroaki, J. Taguchi [Nomura Plating Co, Ltd., Osaka, Japan] K. Okihira, K. Sennyu [MHI, Hiroshima, Japan] F. Saito, H. Umezawa [Tokyo Denkai Co., Ltd., Tokyo, Japan] O. Yushiro [Toshiba Electron Tubes Devices Co., Ltd, Tokyo, Japan]