[n] T.-C. Yu et al., “Planar Balun Design with Advanced Heat Dissipation Structure for kW Level Solid-state Amplifier Module Development”, in Proc. IPAC'13, Shanghai, China, May 2013, paper WEPFI060, pp. 2830-2832.
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Paper Title: Planar Balun Design with Advanced Heat Dissipation Structure for kW Level Solid-state Amplifier Module Development
Paper URL: https://jacow.org/IPAC2013/papers/WEPFI060.pdf
Conference: 4th Int. Particle Accelerator Conf. (IPAC'13)
Paper ID: WEPFI060
Location in proceedings: 2830-2832
Original Author String: T.-C. Yu, L.-H. Chang, M.H. Chang, L.J. Chen, F.-T. Chung, M.-C. Lin, Y.-H. Lin, Z.L. Liu, C.H. Lo, M.H. Tsai, Ch. Wang, T.-T. Yang, M.-S. Yeh [NSRRC, Hsinchu, Taiwan]
