[n] J. F. DeFord, E. M. Nelson, and J. J. Petillo, “Finite-Element 2D 3D PIC Modeling of RF Devices with Applications to Multipacting”, presented at the PAC'05, Knoxville, TN, USA, May 2005, paper WPAT077, unpublished.
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Paper Title: Finite-Element 2D 3D PIC Modeling of RF Devices with Applications to Multipacting
Paper URL: https://jacow.org/p05/papers/WPAT077.pdf
Conference: 21st Particle Accelerator Conf. (PAC'05)
Paper ID: WPAT077
Original Author String: J.F. DeFord, LLNL, Livermore, California; E.M. Nelson, LANL, Los Alamos, New Mexico; J.J. Petillo, SAIC, Burlington, Massachusetts