[n] M. Huck, J. Bahrdt, H. Huck, A. Meseck, and M. Ries, “Transverse Broad-band Impedance Studies of the New In-vacuum Cryogenic Undulator at Bessy II Storage Ring”, in Proc. IBIC'20, Santos, Brazil, Sep. 2020, pp. 263-267. doi:10.18429/JACoW-IBIC2020-THPP26
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Paper Title: Transverse Broad-band Impedance Studies of the New In-vacuum Cryogenic Undulator at Bessy II Storage Ring
Paper URL: http://accelconf.web.cern.ch/ibic2020/papers/THPP26.pdf
Conference: 9th Int. Beam Instrumentation Conf. (IBIC'20)
Paper ID: THPP26
Location in proceedings: 263-267
Original Author String: M. Huck,J. Bahrdt,H. Huck,A. Meseck,M. Ries