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For Word

[n]	M. Lu et al., “Electrochemical Deposition of  Nb?Sn on the Surface of Cu Substrates”, in Proc. SRF'19, Dresden, Germany, Jun.-Jul. 2019, pp. 624-627. doi:10.18429/JACoW-SRF2019-TUP076

For LaTeX

%\cite{Lu:SRF19-TUP076} \bibitem{Lu:SRF19-TUP076} M. Lu \emph{et al.}, \textquotedblleft{Electrochemical Deposition of Nb?Sn on the Surface of Cu Substrates}\textquotedblright, in \emph{Proc. SRF’19}, Dresden, Germany, Jun.-Jul. 2019, pp. 624--627. \url{doi:10.18429/JACoW-SRF2019-TUP076}

For BibTeX

@inproceedings{lu:srf19-tup076, author = {M. Lu and others}, title = {{Electrochemical Deposition of Nb?Sn on the Surface of Cu Substrates}}, booktitle = {Proc. SRF'19}, pages = {624--627}, paper = {TUP076}, venue = {Dresden, Germany, Jun.-Jul. 2019}, publisher = {JACoW Publishing, Geneva, Switzerland}, doi = {10.18429/JACoW-SRF2019-TUP076}, url = {https://jacow.org/srf2019/papers/TUP076.pdf}, language = {english} }

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Metadata

Paper Title: Electrochemical Deposition of Nb?Sn on the Surface of Cu Substrates
Paper URL: https://jacow.org/srf2019/papers/TUP076.pdf
Conference: 19th Int. Conf. RF Superconductivity (SRF'19)
Paper ID: TUP076
Location in proceedings: 624-627
Original Author String: M. Lu,Q. W. Chu,Y. He,Z. Q. Lin,F. Pan,T. Tan,Z. Q. Yang

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