[n] H. Sakai et al., “Improvement of a Clean Assembly Work for Superconducting RF Cryomodule and Its Application to the KEK-STF Cryomodule”, in Proc. SRF'19, Dresden, Germany, Jun.-Jul. 2019, pp. 721-725. doi:10.18429/JACoW-SRF2019-TUP104
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Paper Title: Improvement of a Clean Assembly Work for Superconducting RF Cryomodule and Its Application to the KEK-STF Cryomodule
Paper URL: https://jacow.org/srf2019/papers/TUP104.pdf
Conference: 19th Int. Conf. RF Superconductivity (SRF'19)
Paper ID: TUP104
Location in proceedings: 721-725
Original Author String: H. Sakai,T. Ebisawa,E. Kako,A. Kasugai,T. Konomi,K. Umemori,Y. Yamamoto