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Author: J. Sears


References



Reference
F. Furuta et al., “Updates of Vertical Electropolishing Studies at Cornell with KEK and Marui Galvanizing Co. Ltd .”, in Proc. North American Particle Accelerator Conf. (NAPAC'16), Chicago, IL, USA, Oct. 2016, pp. 208-210.
F. Furuta et al., “Vertical Electro-polishing Collaboration Between Cornell, KEK, and Marui Galvanizing Co. Ltd”, in Proc. 18th Int. Conf. RF Superconductivity (SRF'17), Lanzhou, China, Jul. 2017, pp. 563-566.
F. Furuta et al., “Vertical Electropolishing Studies at Cornell with KEK and Marui”, in Proc. 7th Int. Particle Accelerator Conf. (IPAC'16), Busan, Korea, May 2016, pp. 2295-2297.
F. Furuta et al., “Vertical Electropolishing Studies at Cornell”, in Proc. 17th Int. Conf. RF Superconductivity (SRF'15), Whistler, Canada, Sep. 2015, paper MOPB093, pp. 364-367.
G. Gaitan et al., “Development of a CVD System for Next-Generation SRF Cavities”, in Proc. North American Particle Accelerator Conf. (NAPAC'22), Albuquerque, NM, USA, Aug. 2022, pp. 372-374.
G. Gaitan et al., “Development of a Plasma-Enhanced Chemical Vapor Deposition System for High-Performance SRF Cavities”, presented at the 21th Int. Conf. RF Superconductivity (SRF'23), Grand Rapids, MI, USA, Jun. 2023, paper MOPMB015, unpublished.
G. Gaitan et al., “Development of a System for Coating SRF Cavities Using Remote Plasma CVD”, in Proc. 20th International Conference on RF Superconductivity (SRF'21), East Lansing, MI, USA, Jun.-Jul. 2021, pp. 129.
G. H. Hoffstaetter et al., “CBETA, the 4-Turn ERL with SRF and Single Return Loop”, in Proc. 9th Int. Particle Accelerator Conf. (IPAC'18), Vancouver, Canada, Apr.-May 2018, pp. 635-639.
G. H. Hoffstaetter et al., “Readiness for the Cornell ERL”, in Proc. 4th Int. Particle Accelerator Conf. (IPAC'13), Shanghai, China, May 2013, paper WEPWO061, pp. 2447-2449.
G. M. Ge et al., “Performance of Nitrogen-Doped 9-Cell SRF Cavities in Vertical Tests at Cornell University”, in Proc. 17th Int. Conf. RF Superconductivity (SRF'15), Whistler, Canada, Sep. 2015, paper MOPB084, pp. 328-332.


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