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Author: T. Obina


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Reference
N. Higashi et al., “Low Emittance Lattice for PF-AR”, in Proc. 9th Int. Particle Accelerator Conf. (IPAC'18), Vancouver, Canada, Apr.-May 2018, pp. 4148-4151.
N. Nakamura et al., “Design Work of the ERL-FEL as the High Intense EUV Light Source”, in Proc. 56th Advanced ICFA Beam Dynamics Workshop on Energy Recovery Linacs (ERL'15), Stony Brook, NY, USA, Jun. 2015, pp. 4-9.
N. Nakamura et al., “EUV-FEL light source for future lithography”, in Proc. 14th Int. Particle Accelerator Conf. (IPAC'23), Venice, Italy, May 2023, paper THPM123, pp. 5149-5152.
N. Nakamura et al., “Present Status of the Compact ERL at KEK”, in Proc. 5th Int. Particle Accelerator Conf. (IPAC'14), Dresden, Germany, Jun. 2014, pp. 353-355.
N. Nakamura et al., “Reconstruction and Beam-Transport Study of the cERL Dump Line for High-Power IR-FEL Operation”, in Proc. 13th Int. Particle Accelerator Conf. (IPAC'22), Bangkok, Thailand, Jun. 2022, pp. 1117-1120.
N. Nakamura et al., “Specifications and Performance of a Chicane Magnet for the cERL IR-FEL”, in Proc. 12th Int. Particle Accelerator Conf. (IPAC'21), Campinas, Brazil, May 2021, pp. 1512-1514.
O. A et al., “Evaluation of the Transverse Impedanse of Pf in-Vacuum Undulator Using Local Orbit Bump Method”, in Proc. 7th Int. Beam Instrumentation Conf. (IBIC'18), Shanghai, China, Sep. 2018, pp. 89-92.
O. A. Konstantinova et al., “Bunch by Bunch Intra-Bunch Feedback System for Curing Transverse Beam Instabilities at the J-PARC MR”, in Proc. 4th Int. Particle Accelerator Conf. (IPAC'13), Shanghai, China, May 2013, paper TUPWA009, pp. 1739-1741.
O. A. Tanaka, T. Miyajima, N. Nakamura, T. Obina, M. Shimada, and Y. Tanimoto, “CollimatorÔÇÖs Impact Into the Transverse Emittance Growth at KEK Compact ERL”, in Proc. 10th Int. Particle Accelerator Conf. (IPAC'19), Melbourne, Australia, May 2019, pp. 174-177.
O. Tanaka et al., “Impedance Evaluation of In-Vacuum Undulator at KEK Photon Factory”, in Proc. 9th Int. Particle Accelerator Conf. (IPAC'18), Vancouver, Canada, Apr.-May 2018, pp. 3200-3203.


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