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Author: T. Tan


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Reference
A. D. Wu et al., “The Destructive Effects to the RF Coupler by the Plasma Discharge”, in Proc. 19th Int. Conf. RF Superconductivity (SRF'19), Dresden, Germany, Jun.-Jul. 2019, pp. 285-287.
F. Pan et al., “New Progress for Nb Sputtered 325 MHz QWR Cavities in IMP”, in Proc. 19th Int. Conf. RF Superconductivity (SRF'19), Dresden, Germany, Jun.-Jul. 2019, pp. 621-623.
M. Lu et al., “Electrochemical Deposition of Nb?Sn on the Surface of Cu Substrates”, in Proc. 19th Int. Conf. RF Superconductivity (SRF'19), Dresden, Germany, Jun.-Jul. 2019, pp. 624-627.
A. D. Wu et al., “The Cryostat Results of Carbon Contamination and Plasma Cleaning for the Field Emission on the SRF Cavity”, in Proc. 19th Int. Conf. RF Superconductivity (SRF'19), Dresden, Germany, Jun.-Jul. 2019, pp. 1038-1040.
H. Guo et al., “The Design of an Automated High-Pressure Rinsing System for SRF Cavity and the Outlook for Future Automated Cleanroom on Strings Assembly”, in Proc. 19th Int. Conf. RF Superconductivity (SRF'19), Dresden, Germany, Jun.-Jul. 2019, pp. 1216-1218.
F. Pan et al., “Nb Sputtered 325 MHz QWR Cavities for CiADS”, in Proc. 14th Int. Conf. on Heavy Ion Accelerator Technology (HIAT'18), Lanzhou, China, Oct. 2018, pp. 145-147.
Z. J. Wang et al., “The Status of CiADS Superconducting LINAC”, in Proc. 10th Int. Particle Accelerator Conf. (IPAC'19), Melbourne, Australia, May 2019, pp. 994-997.
Y. L. Huang et al., “Superconducting Elliptical Cavities Developed in IMP for the CiADS”, in Proc. 10th Int. Particle Accelerator Conf. (IPAC'19), Melbourne, Australia, May 2019, pp. 2883-2885.
M. Xu et al., “CiADS and HIAF Superconducting Cavity Development Status and the Transition to Production Stage”, in Proc. 20th International Conference on RF Superconductivity (SRF'21), East Lansing, MI, USA, Jun.-Jul. 2021, pp. 273.
Z. Q. Yang, Y. He, M. Lu, and T. Tan, “Nb3Sn Thin Film Cavity Development at IMP, CAS”, in Proc. 20th International Conference on RF Superconductivity (SRF'21), East Lansing, MI, USA, Jun.-Jul. 2021, paper SUPFDV017, pp..


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