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Author: R. Ischebeck


References



Reference
P. Forck et al., “ARIES-ADA: An R&D Network for Advanced Diagnostics at Accelerators”, in Proc. 7th Int. Beam Instrumentation Conf. (IBIC'18), Shanghai, China, Sep. 2018, pp. 71-74.
E. Ferrari et al., “The ACHIP Experimental Chambers at PSI”, in Proc. 38th Int. Free Electron Laser Conf. (FEL'17), Santa Fe, NM, USA, Aug. 2017, pp. 336-339.
B. Walasek-H?Âhne, P. Forck, K. Hoehne, R. Ischebeck, and G. Kube, “Screens for High Precision Measurements”, in Proc. 8th Int. Beam Instrumentation Conf. (IBIC'19), Malmö, Sweden, Sep. 2019, pp. 242-248.
G. L. Orlandi et al., “FERMI-PSI Collaboration on Nano-Fabricated Wire-Scanners With Sub-Micrometer Resolution: Developments and Measurements.”, in Proc. 8th Int. Beam Instrumentation Conf. (IBIC'19), Malmö, Sweden, Sep. 2019, pp. 249-252.
F. Frei and R. Ischebeck, “Electron Bunch Compression Monitors for Short Bunches - Commissioning Results from SwissFEL”, in Proc. 8th Int. Beam Instrumentation Conf. (IBIC'19), Malmö, Sweden, Sep. 2019, pp. 578-581.
G. L. Orlandi et al., “Wire-Scanners with Sub-Micrometer Resolution: Developments and Measurements”, in Proc. 39th Int. Free Electron Laser Conf. (FEL'19), Hamburg, Germany, Aug. 2019, pp. 307-310.
J. Kirschner et al., “Bayesian Optimisation for Fast and Safe Parameter Tuning of SwissFEL”, in Proc. 39th Int. Free Electron Laser Conf. (FEL'19), Hamburg, Germany, Aug. 2019, pp. 707-710.
R. Ganter et al., “Status of Athos, the Soft X-Ray FEL Line of SwissFEL”, in Proc. 39th Int. Free Electron Laser Conf. (FEL'19), Hamburg, Germany, Aug. 2019, pp. 753-756.
L. Shi, R. Ischebeck, and S. Reiche, “THz Radiator Based on Photonic Band Gap Crystal for SwissFEL”, in Proc. 10th Int. Particle Accelerator Conf. (IPAC'19), Melbourne, Australia, May 2019, pp. 693-696.
M. Nabinger et al., “Efficient Terahertz Generation by Tilted-Pulse-Front Pumping in Lithium Niobate for the Split-Ring Resonator Experiment at FLUTE”, in Proc. 12th Int. Particle Accelerator Conf. (IPAC'21), Campinas, Brazil, May 2021, pp. 4299-4302.


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