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Author: Y. Takeuchi


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Reference
T. Abe et al., “Outgassing Rate of Highly Pure Copper Electroplating Applied to RF Cavities”, in Proc. 10th European Particle Accelerator Conf. (EPAC'06), Edinburgh, UK, Jun. 2006, paper TUPCH126, pp. 1307-1309.
T. Abe, T. Kageyama, H. Sakai, and Y. Takeuchi, “Fine Grooving of Conductor Surfaces of RF Input Coupler to Suppress Multipactoring”, in Proc. 10th European Particle Accelerator Conf. (EPAC'06), Edinburgh, UK, Jun. 2006, paper TUPCH127, pp. 1310-1312.
A. Akiyama et al., “Slow Ground Motion and Large Future Accelerator”, in Proc. 5th European Particle Accelerator Conf. (EPAC'96), Sitges, Spain, Jun. 1996, paper TUP072G, pp. 2600-2602.
K. Akai et al., “Tuning Control and Transient Response of the ARES for KEKB”, in Proc. 5th European Particle Accelerator Conf. (EPAC'96), Sitges, Spain, Jun. 1996, paper WEP046L, pp. 1994-1996.
K. Akai et al., “Quadrupole Counter Mixing Choke Structure for the KEKB ARES Cavity”, in Proc. 5th European Particle Accelerator Conf. (EPAC'96), Sitges, Spain, Jun. 1996, paper WEP048L, pp. 1997-1999.
N. Akasaka, Y. H. Chin, C. K. Ng, K. Tajima, and Y. Takeuchi, “Design of HOM Power Absorbers for the KEK B-Factory”, in Proc. 5th European Particle Accelerator Conf. (EPAC'96), Sitges, Spain, Jun. 1996, paper WEP050L, pp. 2000-2002.
K. Akai et al., “The ARES Cavity for the KEK B-Factory”, in Proc. 5th European Particle Accelerator Conf. (EPAC'96), Sitges, Spain, Jun. 1996, paper WEP054L, pp. 2008-2010.
K. Akai et al., “The Input Coupler for the KEKB ARES Cavity”, in Proc. 5th European Particle Accelerator Conf. (EPAC'96), Sitges, Spain, Jun. 1996, paper WEP058L, pp. 2014-2016.
K. Akai et al., “The SiC Absorber for the KEKB ARES Cavity”, in Proc. 5th European Particle Accelerator Conf. (EPAC'96), Sitges, Spain, Jun. 1996, paper WEP062L, pp. 2020-2022.
K. Akai et al., “Higher-Order Mode HOM Characteristics of the Choke-Mode Cavity for the KEK B-Factory KEKB”, in Proc. 5th European Particle Accelerator Conf. (EPAC'96), Sitges, Spain, Jun. 1996, paper WEP095L, pp. 2074-2078.


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