[n] T. Abe et al., “Outgassing Rate of Highly Pure Copper Electroplating Applied to RF Cavities”, in Proc. EPAC'06, Edinburgh, UK, Jun. 2006, paper TUPCH126, pp. 1307-1309.
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Paper Title: Outgassing Rate of Highly Pure Copper Electroplating Applied to RF Cavities
Conference: 10th European Particle Accelerator Conf. (EPAC'06)
Paper ID: TUPCH126
Location in proceedings: 1307-1309
Original Author String: T. Abe, KEK, Ibaraki; Z. Kabeya, MHI, Nagoya; T. Kageyama, KEK, Ibaraki; T. Kawasumi, MHI, Nagoya; T. Nakamura, S. Nishihashi, Asahi Kinzoku Co., Ltd., Gifu; Y. Saito, H. Sakai, Y. Sato, KEK, Ibaraki; K. Tajiri, Churyo Engineering Co., Ltd., Nagoya; Y. Takeuchi, KEK, Ibaraki; K. Tsujimoto, Asahi Kinzoku Co., Ltd., Gifu
