|
T. Abe et al., “Outgassing Rate of Highly Pure Copper Electroplating Applied to RF Cavities”, in Proc. 10th European Particle Accelerator Conf. (EPAC'06), Edinburgh, UK, Jun. 2006, paper TUPCH126, pp. 1307-1309. |
|
T. Abe et al., “Application of Highly-Pure Copper Lining to Normal-Conducting RF Cavities for an Electron-Positron Super B Factory”, in Proc. 21st Particle Accelerator Conf. (PAC'05), Knoxville, TN, USA, May 2005, paper TPPT007, pp. 1051-1053. |
