7th Int. Beam Instrumentation Conf. (IBIC'18)
Shanghai, China, Sep. 2018
References
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Reference
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S. R. Marques, G. B. M. Bruno, L. M. Russo, H. A. Silva, and D. O. Tavares, “Commissioning of the Open Source Sirius BPM Electronics”, in Proc. 7th Int. Beam Instrumentation Conf. (IBIC'18), Shanghai, China, Sep. 2018, pp. 196-203. |
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S. S. Cao, J. Chen, Y. B. Leng, and R. X. Yuan, “The Application of Beam Arrival Time Measurement at SXFEL”, in Proc. 7th Int. Beam Instrumentation Conf. (IBIC'18), Shanghai, China, Sep. 2018, pp. 342-345. |
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S. Seletskiy et al., “Status of the BNL LEReC Machine Protection System”, in Proc. 7th Int. Beam Instrumentation Conf. (IBIC'18), Shanghai, China, Sep. 2018, pp. 249-252. |
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S. V. Cao, M. L. Friend, M. Hartz, A. Nakamura, and K. Sakashita, “Optical System of Beam Induced Fluorescence Monitor Toward MW Beam Power at the J-PARC Neutrino Beamline”, in Proc. 7th Int. Beam Instrumentation Conf. (IBIC'18), Shanghai, China, Sep. 2018, pp. 505-508. |
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T. A. Miller et al., “Overview of Beam Instrumentation and Commissioning Results from the Coherent Electron Cooling Experiment at BNL”, in Proc. 7th Int. Beam Instrumentation Conf. (IBIC'18), Shanghai, China, Sep. 2018, pp. 43-47. |
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T. C. Zhao et al., “The Beam Instruments for HIMM@IMP”, in Proc. 7th Int. Beam Instrumentation Conf. (IBIC'18), Shanghai, China, Sep. 2018, pp. 33-35. |
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T. E. Levens, T. Lef?¿vre, and D. Valuch, “Initial Results from the LHC Multi-Band Instability Monitor”, in Proc. 7th Int. Beam Instrumentation Conf. (IBIC'18), Shanghai, China, Sep. 2018, pp. 314-318. |
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T. Lensch, S. Liu, and M. Scholz, “The European XFEL Wire Scanner System”, in Proc. 7th Int. Beam Instrumentation Conf. (IBIC'18), Shanghai, China, Sep. 2018, pp. 498-500. |
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T. R. Furness et al., “Adaptive Collimator Design for Future Particle Accelerators”, in Proc. 7th Int. Beam Instrumentation Conf. (IBIC'18), Shanghai, China, Sep. 2018, pp. 240-244. |
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T. Wamsat and T. Lensch, “The European XFEL Beam Loss Monitor System”, in Proc. 7th Int. Beam Instrumentation Conf. (IBIC'18), Shanghai, China, Sep. 2018, pp. 357-360. |
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