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[n] S. H. Kim, Y. S. Cho, T. Y. Kim, and K. H. Chung, “Pulsed VUV Synchrotron Radiation Source”, in Proc. PAC'95, Dallas, TX, USA, May 1995, paper FAA10, pp. 216-218.
[n] E. Panofski et al., “Developing a 50 MeV LPA-Based Injector at ATHENA for a Compact Storage Ring”, in Proc. IPAC'21, Campinas, Brazil, May 2021, pp. 1765-1768. doi:10.18429/JACoW-IPAC2021-TUPAB163
[n] L. Shang, W. Liu, Y. Lu, F. L. Shang, and Z. B. Sun, “Considerations of the HALS Injection System and a New Non-linear Kicker Design”, in Proc. IPAC'17, Copenhagen, Denmark, May 2017, pp. 1503-1505. doi:10.18429/JACoW-IPAC2017-TUPAB080
[n] P. Sanchez Navarro, “Thermal Contact Conductance in a Typical Silicon Crystal Assembly Found in Particle Accelerators”, in Proc. MEDSI'20, Chicago, USA, Jul. 2021, pp. 353. doi:10.18429/JACoW-MEDSI2020-THOB01
[n] A. Enomoto et al., “Re-formation of the PF 2.5-GeV Linac to 8 GeV”, in Proc. LINAC'94, Tsukuba, Japan, Aug. 1994, paper MO-54, pp. 184-186.
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References
- S. H. Kim, Y. S. Cho, T. Y. Kim, and K. H. Chung, “Pulsed VUV Synchrotron Radiation Source”, in Proc. 16th Particle Accelerator Conf. (PAC'95), Dallas, TX, USA, May 1995, paper FAA10, pp. 216-218.
- E. Panofski et al., “Developing a 50 MeV LPA-Based Injector at ATHENA for a Compact Storage Ring”, in Proc. 12th Int. Particle Accelerator Conf. (IPAC'21), Campinas, Brazil, May 2021, pp. 1765-1768.
- L. Shang, W. Liu, Y. Lu, F. L. Shang, and Z. B. Sun, “Considerations of the HALS Injection System and a New Non-linear Kicker Design”, in Proc. 8th Int. Particle Accelerator Conf. (IPAC'17), Copenhagen, Denmark, May 2017, pp. 1503-1505.
- P. Sanchez Navarro, “Thermal Contact Conductance in a Typical Silicon Crystal Assembly Found in Particle Accelerators”, in Proc. 11th Mechanical Engineering Design of Synchrotron Radiation Equipment and Instrumentation Conf. (MEDSI'20), Chicago, USA, Jul. 2021, pp. 353.
- A. Enomoto et al., “Re-formation of the PF 2.5-GeV Linac to 8 GeV”, in Proc. 1994 Linear Accelerator Conf. (LINAC'94), Tsukuba, Japan, Aug. 1994, paper MO-54, pp. 184-186.
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