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The page numbers for some of these references could not be added automatically. You must provide the page numbers from the original proceedings which is located at JACoW.org, and substitute ‘pp. XX-XX’ with the correct page numbers.
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[n] J. J. Petillo, K. Jensen, B. Levush, and J. N. P. Panagos, “Detailed Photoemission Modeling Using the 3D Finite-Element PIC Code MICHELLE”, in Proc. PAC'07, Albuquerque, NM, USA, Jun. 2007, paper TUODC01, pp. 904-904.
[n] P. Junphong, Mr. Ano, S. Rattanarin, Dr. Suwannakachorn, A. Takahashi, and T. Vilaithong, “System Development of a Time-of-flight Spectrometer for Surface Analysis of Materials”, in Proc. EPAC'06, Edinburgh, UK, Jun. 2006, paper THPCH126, pp. 3095-3097.
[n] V. Miltchev et al., “Measurements of Thermal Emittance for Cesium Telluride Photocathodes at PITZ”, in Proc. FEL'05, Palo Alto, CA, USA, Aug. 2005, paper THPP042, pp. XX-XX.
[n] B. Kehrer et al., “Filling Pattern Measurements Using Dead-Time Corrected Single Photon Counting”, in Proc. IPAC'18, Vancouver, Canada, Apr.-May 2018, pp. 2219-2222. doi:10.18429/JACoW-IPAC2018-WEPAL027
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References
- J. J. Petillo, K. Jensen, B. Levush, and J. N. P. Panagos, “Detailed Photoemission Modeling Using the 3D Finite-Element PIC Code MICHELLE”, in Proc. 22nd Particle Accelerator Conf. (PAC'07), Albuquerque, NM, USA, Jun. 2007, paper TUODC01, pp. 904-904.
- P. Junphong, Mr. Ano, S. Rattanarin, Dr. Suwannakachorn, A. Takahashi, and T. Vilaithong, “System Development of a Time-of-flight Spectrometer for Surface Analysis of Materials”, in Proc. 10th European Particle Accelerator Conf. (EPAC'06), Edinburgh, UK, Jun. 2006, paper THPCH126, pp. 3095-3097.
- V. Miltchev et al., “Measurements of Thermal Emittance for Cesium Telluride Photocathodes at PITZ”, in Proc. 27th Int. Free Electron Laser Conf. (FEL'05), Palo Alto, CA, USA, Aug. 2005, paper THPP042, pp. XX-XX.
- B. Kehrer et al., “Filling Pattern Measurements Using Dead-Time Corrected Single Photon Counting”, in Proc. 9th Int. Particle Accelerator Conf. (IPAC'18), Vancouver, Canada, Apr.-May 2018, pp. 2219-2222.
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