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[n]	H. H?ñhnel, A. Ate, and U. Ratzinger, “A 3D Printed IH-Type Linac Structure - Proof-of-Concept for Additive Manufacturing of Linac RF Cavities”, in Proc. HIAT'22, Darmstadt, Germany, Jun.-Jul. 2022, pp. 41-45. doi:10.18429/JACoW-HIAT2022-TU1C4

[n]	F. B. Lockwood Estrin, J. W. Bradley, R. Valizadeh, A. N. Hannah, G. B. G. Stenning, and E. Seiler, “Using HiPIMS to Deposit V3Si Superconducting Thin Films”, in Proc. SRF'21, East Lansing, MI, USA, Jun.-Jul. 2021, paper WEPFDV009, pp.. 

For LaTeX

%\cite{H?ñhnel:HIAT22-TU1C4} \bibitem{H?ñhnel:HIAT22-TU1C4} H. H?ñhnel, A. Ate, and U. Ratzinger, \textquotedblleft{A 3D Printed IH-Type Linac Structure - Proof-of-Concept for Additive Manufacturing of Linac RF Cavities}\textquotedblright, in \emph{Proc. HIAT’22}, Darmstadt, Germany, Jun.-Jul. 2022, pp. 41--45. \doi{10.18429/JACoW-HIAT2022-TU1C4} %\cite{Lockwood Estrin:SRF21-WEPFDV009} \bibitem{Lockwood Estrin:SRF21-WEPFDV009} F. B. Lockwood Estrin, J. W. Bradley, R. Valizadeh, A. N. Hannah, G. B. G. Stenning, and E. Seiler, \textquotedblleft{Using HiPIMS to Deposit V3Si Superconducting Thin Films}\textquotedblright, in \emph{Proc. SRF’21}, East Lansing, MI, USA, Jun.-Jul. 2021, paper WEPFDV009, pp..

For BibTeX

@inproceedings{h?ñhnel:hiat22-tu1c4, author = {H. H?ñhnel and A. Ate and U. Ratzinger}, title = {{A 3D Printed IH-Type Linac Structure - Proof-of-Concept for Additive Manufacturing of Linac RF Cavities}}, booktitle = {Proc. HIAT'22}, pages = {41--45}, paper = {TU1C4}, venue = {Darmstadt, Germany}, series = {International Conference on Heavy Ion Accelerator Technology}, number = {15}, publisher = {JACoW Publishing, Geneva, Switzerland}, month = {9}, year = {2022}, issn = {2673-5547}, isbn = {978-3-95-450240-0}, doi = {10.18429/JACoW-HIAT2022-TU1C4}, language = {english} } @inproceedings{lockwood estrin:srf21-wepfdv009, author = {F. B. Lockwood Estrin and J. W. Bradley and R. Valizadeh and A. N. Hannah and G. B. G. Stenning and E. Seiler}, title = {{Using HiPIMS to Deposit V3Si Superconducting Thin Films}}, booktitle = {Proc. SRF'21}, pages = {}, paper = {WEPFDV009}, venue = {East Lansing, MI, USA}, series = {International Conference on RF Superconductivity}, number = {20}, publisher = {JACoW Publishing, Geneva, Switzerland}, month = {10}, year = {2022}, issn = {2673-5504}, isbn = {978-3-95-450233-2}, language = {english} }

References

• H. H?ñhnel, A. Ate, and U. Ratzinger, “A 3D Printed IH-Type Linac Structure - Proof-of-Concept for Additive Manufacturing of Linac RF Cavities”, in Proc. 15th International Conference on Heavy Ion Accelerator Technology (HIAT'22), Darmstadt, Germany, Jun.-Jul. 2022, pp. 41-45.
• F. B. Lockwood Estrin, J. W. Bradley, R. Valizadeh, A. N. Hannah, G. B. G. Stenning, and E. Seiler, “Using HiPIMS to Deposit V3Si Superconducting Thin Films”, in Proc. 20th International Conference on RF Superconductivity (SRF'21), East Lansing, MI, USA, Jun.-Jul. 2021, paper WEPFDV009, pp..