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[n]	H. Hu, D. Bafia, and Y.-K. Kim, “Origins of quench in buffered chemical polished and low temperature baked SRF cavities”, in Proc. IPAC'23, Venice, Italy, May 2023, pp. 3082-3085. doi:10.18429/JACoW-IPAC2023-WEPA190

For LaTeX

%\cite{HHu:IPAC23-WEPA190} \bibitem{HHu:IPAC23-WEPA190} H. Hu, D. Bafia, and Y.-K. Kim, \textquotedblleft{Origins of quench in buffered chemical polished and low temperature baked SRF cavities}\textquotedblright, in \emph{Proc. IPAC’23}, Venice, Italy, May 2023, pp. 3082--3085. \doi{10.18429/JACoW-IPAC2023-WEPA190}

For BibTeX

@inproceedings{hhu:ipac23-wepa190, author = {H. Hu and D. Bafia and Y.-K. Kim}, title = {{Origins of quench in buffered chemical polished and low temperature baked SRF cavities}}, booktitle = {Proc. IPAC'23}, pages = {3082--3085}, paper = {WEPA190}, venue = {Venice, Italy}, series = {International Particle Accelerator Conference}, number = {14}, publisher = {JACoW Publishing, Geneva, Switzerland}, month = {9}, year = {2023}, issn = {2673-5490}, isbn = {978-3-95-450231-8}, doi = {10.18429/JACoW-IPAC2023-WEPA190}, language = {english} }

References

• H. Hu, D. Bafia, and Y.-K. Kim, “Origins of quench in buffered chemical polished and low temperature baked SRF cavities”, in Proc. 14th Int. Particle Accelerator Conf. (IPAC'23), Venice, Italy, May 2023, paper WEPA190, pp. 3082-3085.