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[n]	B. Cheymol, “Estimation of the Thermal Load and Signal Level of the ESS Wire Scanner”, in Proc. LINAC'14, Geneva, Switzerland, Aug.-Sep. 2014, paper MOPP036, pp. 137-139. 

[n]	A. Potet et al., “Bi-periodic undulator innovative insertion device for SOLEIL II”, in Proc. IPAC'23, Venice, Italy, May 2023, pp. 3819-3821. doi:10.18429/JACoW-IPAC2023-WEPM108

[n]	Y. Luo et al., “Development and progress of the high-power solid-state amplifiers for HEPS”, in Proc. IPAC'23, Venice, Italy, May 2023, pp. 3599-3601. doi:10.18429/JACoW-IPAC2023-WEPM014

For LaTeX

%\cite{Cheymol:LINAC14-MOPP036} \bibitem{Cheymol:LINAC14-MOPP036} B. Cheymol, \textquotedblleft{Estimation of the Thermal Load and Signal Level of the ESS Wire Scanner}\textquotedblright, in \emph{Proc. LINAC’14}, Geneva, Switzerland, Aug.-Sep. 2014, paper MOPP036, pp. 137--139. %\cite{Potet:IPAC23-WEPM108} \bibitem{Potet:IPAC23-WEPM108} A. Potet \emph{et al.}, \textquotedblleft{Bi-periodic undulator innovative insertion device for SOLEIL II}\textquotedblright, in \emph{Proc. IPAC’23}, Venice, Italy, May 2023, pp. 3819--3821. \doi{10.18429/JACoW-IPAC2023-WEPM108} %\cite{Luo:IPAC23-WEPM014} \bibitem{Luo:IPAC23-WEPM014} Y. Luo \emph{et al.}, \textquotedblleft{Development and progress of the high-power solid-state amplifiers for HEPS}\textquotedblright, in \emph{Proc. IPAC’23}, Venice, Italy, May 2023, pp. 3599--3601. \doi{10.18429/JACoW-IPAC2023-WEPM014}

For BibTeX

@inproceedings{cheymol:linac14-mopp036, author = {B. Cheymol}, title = {{Estimation of the Thermal Load and Signal Level of the ESS Wire Scanner}}, booktitle = {Proc. LINAC'14}, pages = {137--139}, paper = {MOPP036}, venue = {Geneva, Switzerland}, series = {Linear Accelerator Conference}, number = {27}, publisher = {JACoW Publishing, Geneva, Switzerland}, month = {12}, year = {2014}, isbn = {978-3-95-450142-7}, url = {https://jacow.org/LINAC2014/papers/MOPP036.pdf}, language = {english} } @inproceedings{potet:ipac23-wepm108, author = {A. Potet and others}, title = {{Bi-periodic undulator innovative insertion device for SOLEIL II}}, booktitle = {Proc. IPAC'23}, pages = {3819--3821}, paper = {WEPM108}, venue = {Venice, Italy}, series = {International Particle Accelerator Conference}, number = {14}, publisher = {JACoW Publishing, Geneva, Switzerland}, month = {9}, year = {2023}, issn = {2673-5490}, isbn = {978-3-95-450231-8}, doi = {10.18429/JACoW-IPAC2023-WEPM108}, language = {english} } @inproceedings{luo:ipac23-wepm014, author = {Y. Luo and others}, title = {{Development and progress of the high-power solid-state amplifiers for HEPS}}, booktitle = {Proc. IPAC'23}, pages = {3599--3601}, paper = {WEPM014}, venue = {Venice, Italy}, series = {International Particle Accelerator Conference}, number = {14}, publisher = {JACoW Publishing, Geneva, Switzerland}, month = {9}, year = {2023}, issn = {2673-5490}, isbn = {978-3-95-450231-8}, doi = {10.18429/JACoW-IPAC2023-WEPM014}, language = {english} }

References

• B. Cheymol, “Estimation of the Thermal Load and Signal Level of the ESS Wire Scanner”, in Proc. 27th Linear Accelerator Conf. (LINAC'14), Geneva, Switzerland, Aug.-Sep. 2014, paper MOPP036, pp. 137-139.
• A. Potet et al., “Bi-periodic undulator innovative insertion device for SOLEIL II”, in Proc. 14th Int. Particle Accelerator Conf. (IPAC'23), Venice, Italy, May 2023, paper WEPM108, pp. 3819-3821.
• Y. Luo et al., “Development and progress of the high-power solid-state amplifiers for HEPS”, in Proc. 14th Int. Particle Accelerator Conf. (IPAC'23), Venice, Italy, May 2023, paper WEPM014, pp. 3599-3601.