Reference Search

Favourites

For Word

[n]	O. Bagnato, R. Defavari, F. Francisco, and D. Kakizaki, “Characterization of Sn100cv filler metal in UNS C10700 copper silver alloy vacuum soldering for Sirius vacuum chamber manufacturing”, presented at the IPAC'23, Venice, Italy, May 2023, paper THPM014, unpublished. 

For LaTeX

%\cite{Bagnato:IPAC23-THPM014} \bibitem{Bagnato:IPAC23-THPM014} O. Bagnato, R. Defavari, F. Francisco, and D. Kakizaki, \textquotedblleft{Characterization of Sn100cv filler metal in UNS C10700 copper silver alloy vacuum soldering for Sirius vacuum chamber manufacturing}\textquotedblright, presented at the IPAC’23, Venice, Italy, May 2023, paper THPM014, unpublished.

For BibTeX

@unpublished{bagnato:ipac23-thpm014, author = {O. Bagnato and R. Defavari and F. Francisco and D. Kakizaki}, title = {{Characterization of Sn100cv filler metal in UNS C10700 copper silver alloy vacuum soldering for Sirius vacuum chamber manufacturing}}, booktitle = {Proc. IPAC'23}, pages = {}, paper = {THPM014}, venue = {Venice, Italy}, intype = {presented at the}, series = {International Particle Accelerator Conference}, number = {14}, publisher = {JACoW Publishing, Geneva, Switzerland}, month = {9}, year = {2023}, issn = {2673-5490}, isbn = {978-3-95-450231-8}, note = {presented at IPAC'23, Venice, Italy, May 2023, paper THPM014, unpublished}, language = {english} }

References

• O. Bagnato, R. Defavari, F. Francisco, and D. Kakizaki, “Characterization of Sn100cv filler metal in UNS C10700 copper silver alloy vacuum soldering for Sirius vacuum chamber manufacturing”, presented at the 14th Int. Particle Accelerator Conf. (IPAC'23), Venice, Italy, May 2023, paper THPM014, unpublished.