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[n]	M. Crane, R. Mackenzie, R. Sass, and T. Himel, “Network Upgrade for the SLC: Control System Modifications”, in Proc. PAC'97, Vancouver, Canada, May 1997, paper 3P050, pp. 2476-2478. 
[n]	D. Martin and P. Cliff, “A Pulse Amplifier for Nuclear Instrumentation”, in Proc. PAC'87, Washington D.C., USA, Mar. 1987, pp. 1633-1636. 
[n]	W. Wan, C. Gattuso, D. E. Johnson, C. S. Mishra, and J. T. Volk, “Design and Implementation of the Medium-Beta Insert of the Fermilab Recycler Ring”, in Proc. PAC'01, Chicago, IL, USA, Jun. 2001, paper RPPH308, pp. 3621-3623. 
[n]	C. Benedetti, E. Esarey, W. Leemans, T. J. Mehrling, and C. B. Schroeder, “Emittance Preservation in Plasma-Based Accelerators with Ion Motion”, in Proc. IPAC'18, Vancouver, Canada, Apr.-May 2018, pp. 4654-4657. doi:10.18429/JACoW-IPAC2018-THPML002
[n]	G. Velev et al., “New Measurements of Sextupole Field Decay and Snapback Effect on Tevatron Dipole Magnets”, in Proc. EPAC'06, Edinburgh, UK, Jun. 2006, paper WEPLS110, pp. 2640-2642. 
[n]	J. Reid and H. Miller, “A 200 KW Power Amplifier and Solid State Driver for the Fermilab Main Injector”, in Proc. PAC'95, Dallas, TX, USA, May 1995, paper TAQ11, pp. 1544-1546. 
[n]	F. Caspers, E. Jensen, and F. Ruggiero, “Impedance Measurements for the Pumping Holes in the LHC Liner”, in Proc. EPAC'92, Berlin, Germany, Mar. 1992, pp. 889-892. 
[n]	O. Dressler and J. Feikes, “Operational Experiences with the BESSY II Injection System”, in Proc. PAC'99, New York, NY, USA, Mar. 1999, paper TUA87, pp. 1279-1281. 
[n]	Y. Takeuchi, T. Abe, T. Kageyama, and H. Sakai, “RF Dielectric Properties of SiC Ceramics and their Application to Design of HOM Absorbers”, in Proc. PAC'05, Knoxville, TN, USA, May 2005, paper WPAT010, pp. 1195-1197. 
[n]	R. L. Kustom, G. Mavrogenes, and G. Nicholls, “The RF System of the Synchrotron X-Ray Source at Argonne”, in Proc. PAC'87, Washington D.C., USA, Mar. 1987, pp. 1910-1913. 
[n]	D. Popov, O. Karamyshev, I. D. Lyapin, V. Malinin, and S. G. Shirkov, “Beam Extraction Simulation and Magnetic Channels’ Design For MSC230 Cyclotron”, in Proc. Cyclotrons'22, Beijing, China, Dec. 2022, paper THAO02, pp. 260-263. doi:10.18429/JACoW-CYCLOTRONS2022-THAO02

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