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[n]	F. Micolon et al., “Solder joint cryogenic fatigue of the RHIC 12x150A current leads and mitigation for future operation”, in Proc. IPAC'24, Nashville, TN, USA, May 2024, pp. 1556-1559. doi:10.18429/JACoW-IPAC2024-TUPR56

For LaTeX

%\cite{Micolon:IPAC24-TUPR56} \bibitem{Micolon:IPAC24-TUPR56} F. Micolon \emph{et al.}, \textquotedblleft{Solder joint cryogenic fatigue of the RHIC 12x150A current leads and mitigation for future operation}\textquotedblright, in \emph{Proc. IPAC’24}, Nashville, TN, USA, May 2024, pp. 1556--1559. \url{doi:10.18429/JACoW-IPAC2024-TUPR56}

For BibTeX

@inproceedings{micolon:ipac24-tupr56, author = {F. Micolon and others}, title = {{Solder joint cryogenic fatigue of the RHIC 12x150A current leads and mitigation for future operation}}, booktitle = {Proc. IPAC'24}, pages = {1556--1559}, paper = {TUPR56}, venue = {Nashville, TN, USA}, series = {International Particle Accelerator Conference}, number = {15}, publisher = {JACoW Publishing, Geneva, Switzerland}, month = {7}, year = {2024}, issn = {2673-5490}, isbn = {978-3-95-450247-9}, doi = {10.18429/JACoW-IPAC2024-TUPR56}, language = {english} }

References

• F. Micolon et al., “Solder joint cryogenic fatigue of the RHIC 12x150A current leads and mitigation for future operation”, in Proc. 15th Int. Particle Accelerator Conf. (IPAC'24), Nashville, TN, USA, May 2024, paper TUPR56, pp. 1556-1559.