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[n]	T. Y. Chung et al., “Reduction of Dynamic Multipole Content in Insertion Devices Using Flat Wires”, in Proc. IPAC'18, Vancouver, Canada, Apr.-May 2018, pp. 4313-4316. doi:10.18429/JACoW-IPAC2018-THPMK012
[n]	P. Mueller et al., “HPR and plasma processing of a superconducting 360 MHz CH cavity”, in Proc. IPAC'24, Nashville, TN, USA, May 2024, pp. 2754-2756. doi:10.18429/JACoW-IPAC2024-WEPS27

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