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[n]	A. Matheisen et al., “Industrialization of European XFEL Preparation Cycle ``BCP Flash'' at Ettore Zanon Company”, in Proc. SRF'13, Paris, France, Sep. 2013, paper TUP056, pp. 547-550. 

[n]	E. Kako et al., “Quality Control of Copper Plating in STF-2 Input Power Couplers”, in Proc. SRF'17, Lanzhou, China, Jul. 2017, pp. 186-190. doi:10.18429/JACoW-SRF2017-MOPB061

For LaTeX

%\cite{Matheisen:SRF13-TUP056} \bibitem{Matheisen:SRF13-TUP056} A. Matheisen \emph{et al.}, \textquotedblleft{Industrialization of European XFEL Preparation Cycle ``BCP Flash'' at Ettore Zanon Company}\textquotedblright, in \emph{Proc. SRF’13}, Paris, France, Sep. 2013, paper TUP056, pp. 547--550. %\cite{Kako:SRF17-MOPB061} \bibitem{Kako:SRF17-MOPB061} E. Kako \emph{et al.}, \textquotedblleft{Quality Control of Copper Plating in STF-2 Input Power Couplers}\textquotedblright, in \emph{Proc. SRF’17}, Lanzhou, China, Jul. 2017, pp. 186--190. \doi{10.18429/JACoW-SRF2017-MOPB061}

For BibTeX

@inproceedings{matheisen:srf13-tup056, author = {A. Matheisen and others}, title = {{Industrialization of European XFEL Preparation Cycle ``BCP Flash'' at Ettore Zanon Company}}, booktitle = {Proc. SRF'13}, pages = {547--550}, paper = {TUP056}, venue = {Paris, France, Sep. 2013}, publisher = {JACoW Publishing, Geneva, Switzerland}, url = {https://jacow.org/SRF2013/papers/TUP056.pdf}, language = {english} } @inproceedings{kako:srf17-mopb061, author = {E. Kako and others}, title = {{Quality Control of Copper Plating in STF-2 Input Power Couplers}}, booktitle = {Proc. SRF'17}, pages = {186--190}, paper = {MOPB061}, venue = {Lanzhou, China, Jul. 2017}, publisher = {JACoW Publishing, Geneva, Switzerland}, doi = {10.18429/JACoW-SRF2017-MOPB061}, url = {https://jacow.org/srf2017/papers/MOPB061.pdf}, language = {english} }

References

• A. Matheisen et al., “Industrialization of European XFEL Preparation Cycle ``BCP Flash'' at Ettore Zanon Company”, in Proc. 16th Int. Conf. RF Superconductivity (SRF'13), Paris, France, Sep. 2013, paper TUP056, pp. 547-550.
• E. Kako et al., “Quality Control of Copper Plating in STF-2 Input Power Couplers”, in Proc. 18th Int. Conf. RF Superconductivity (SRF'17), Lanzhou, China, Jul. 2017, pp. 186-190.