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[n]	Y. Yamamoto et al., “Availability of the TiN Coating-Free Ceramic in the STF-type Power Coupler for ILC”, in Proc. IPAC'18, Vancouver, Canada, Apr.-May 2018, pp. 2819-2821. doi:10.18429/JACoW-IPAC2018-WEPML053
[n]	A. Hocker et al., “Individual RF Test Results of the Cavities Used in the First US-built ILC-type Cryomodule”, in Proc. IPAC'12, New Orleans, LA, USA, May 2012, paper WEPPC049, pp. 2321-2323. 

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