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[n]	B. Rusnak, “RF Power and HOM Coupler Tutorial”, in Proc. SRF'03, Lübeck, Germany, Sep. 2003, paper TUT02, pp. 496-515. 

[n]	M. M. Musardo et al., “3D Hall Probe Calibration System at Insertion Device Magnetic Measurement Facility at BNL”, in Proc. NAPAC'13, Pasadena, CA, USA, Sep.-Oct. 2013, paper THPAC14, pp. 1169-1171. 

For LaTeX

%\cite{Rusnak:SRF03-TUT02} \bibitem{Rusnak:SRF03-TUT02} B. Rusnak, \textquotedblleft{RF Power and HOM Coupler Tutorial}\textquotedblright, in \emph{Proc. SRF’03}, Lübeck, Germany, Sep. 2003, paper TUT02, pp. 496--515. %\cite{Musardo:NAPAC13-THPAC14} \bibitem{Musardo:NAPAC13-THPAC14} M. M. Musardo \emph{et al.}, \textquotedblleft{3D Hall Probe Calibration System at Insertion Device Magnetic Measurement Facility at BNL}\textquotedblright, in \emph{Proc. NAPAC’13}, Pasadena, CA, USA, Sep.-Oct. 2013, paper THPAC14, pp. 1169--1171.

For BibTeX

@inproceedings{rusnak:srf03-tut02, author = {B. Rusnak}, title = {{RF Power and HOM Coupler Tutorial}}, booktitle = {Proc. SRF'03}, pages = {496--515}, paper = {TUT02}, venue = {Lübeck, Germany, Sep. 2003}, publisher = {JACoW Publishing, Geneva, Switzerland}, url = {https://jacow.org/SRF2003/papers/TUT02.pdf}, language = {english} } @inproceedings{musardo:napac13-thpac14, author = {M. M. Musardo and others}, title = {{3D Hall Probe Calibration System at Insertion Device Magnetic Measurement Facility at BNL}}, booktitle = {Proc. NAPAC'13}, pages = {1169--1171}, paper = {THPAC14}, venue = {Pasadena, CA, USA, Sep.-Oct. 2013}, publisher = {JACoW Publishing, Geneva, Switzerland}, url = {https://jacow.org/PAC2013/papers/THPAC14.pdf}, language = {english} }

References

• B. Rusnak, “RF Power and HOM Coupler Tutorial”, in Proc. 11th Workshop RF Superconductivity (SRF'03), Lübeck, Germany, Sep. 2003, paper TUT02, pp. 496-515.
• M. M. Musardo et al., “3D Hall Probe Calibration System at Insertion Device Magnetic Measurement Facility at BNL”, in Proc. North American Particle Accelerator Conf. (NAPAC'13), Pasadena, CA, USA, Sep.-Oct. 2013, paper THPAC14, pp. 1169-1171.