JaCoW Logo

Reference Search

Favourites


For Word

[n]	S. Okuda, T. Kojima, R. Taniguchi, and Y. Tanaka, “Low-Intensity Electron Beam Monitoring and Beam Applications at OPU Linac”, in Proc. LINAC'06, Knoxville, TN, USA, Aug. 2006, paper TUP018, pp. 286-288. 
[n]	H. Zhang and Y. Zhang, “MEIC Electron Cooling Simulation Using Betacool”, in Proc. NAPAC'13, Pasadena, CA, USA, Sep.-Oct. 2013, paper TUPHO04, pp. 586-588. 
[n]	K. Yamamoto, “J-PARC Recovery Status”, in Proc. HB'12, Beijing, China, Sep. 2012, paper MOI1A02, pp. 6-10. 
[n]	O. K. Kester, “High Intensity Issues at FAIR”, in Proc. HB'12, Beijing, China, Sep. 2012, paper MOI1B01, pp. 11-14. 
[n]	W. Fischer et al., “Analysis of Intensity Instability Threshold at Transition in RHIC”, in Proc. EPAC'08, Genoa, Italy, Jun. 2008, paper TUPP035, pp. 1616-1618. 
[n]	G. V. Eremeev, “Exploration of Very High Gradient Cavities”, in Proc. SRF'11, Chicago, IL, USA, Jul. 2011, paper THPO005, pp. 698-701. 
[n]	S. Chel, M. Desmons, C. Travier, T. Garvey, P. Lepercq, and R. Panvier, “Coaxial Disc Windows for a High Power Superconducting Cavity Input Coupler”, in Proc. PAC'99, New York, NY, USA, Mar. 1999, paper MOP108, pp. 916-918. 
[n]	J. Maslow, J. Coleman, T. Kelehan, V. Rodriguez, and J. Koglin, “Modernization of DARHT axis-I debris blocker”, in Proc. IPAC'24, Nashville, TN, USA, May 2024, pp. 3428-3430. doi:10.18429/JACoW-IPAC2024-THPG67
[n]	C. Z. Antoine and R. Crooks, “Reducing Electropolishing Time with Chemical-Mechanical Polishing”, in Proc. SRF'09, Berlin, Germany, Sep. 2009, paper TUPPO071, pp. 405-405. 
[n]	G. Isoyama, S. Suemine, S. Okuda, and T. Yamamoto, “High-Intensity Single-Bunch Electron Beam Generation with the 38 MeV L-Band Linac in Osaka University”, in Proc. LINAC'00, Monterey, CA, USA, Aug. 2000, paper MOB20, pp. 140-142. 
[n]	H. Hotchi et al., “High Intensity Beam Trial of up to 540 kW in J-PARC RCS”, in Proc. IPAC'13, Shanghai, China, May 2013, paper THPWO033, pp. 3836-3838. 
[n]	D. Saez de Jauregui et al., “Characterization of Vacuum Chamber Samples for Superconducting Insertion Devices”, in Proc. IPAC'12, New Orleans, LA, USA, May 2012, paper MOPPP070, pp. 723-725. 

For LaTeX

Use Complete Form

For BibTeX

References

Back to search