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[n] J. Shi, L. Jin, D. Wang, and F. Wang, “Beam-Beam Effects in the Ring-Ring Version of eRHIC”, in Proc. PAC'05, Knoxville, TN, USA, May 2005, paper TPPP017, pp. 1520-1522.
[n] D. G. Moore, O. Goudard, and L. Hardy, “j5 Logbook - A Commercial e-logbook”, in Proc. PCaPAC'08, Ljbuljana, Slovenia, Oct. 2008, paper TUX04, pp. 52-54.
[n] J. Fessenden, “Emittance Variations in Current-Amplifying Ion Induction Linacs”, in Proc. PAC'91, San Francisco, CA, USA, May 1991, pp. 586-591.
[n] M. A. K. Othman et al., “High-Gradient Tests of W-Band Accelerating Structures”, presented at the NAPAC'19, Lansing, MI, USA, Sep. 2019, paper THYBB4, unpublished.
[n] T. Higo, R. M. Jones, R. H. Miller, T. O. Raubenheimer, G. V. Stupakov, and J. W. Wang, “The Influence of Fabrication Errors on the Wakefield and Emittance Growth for the Next Linear Collider”, in Proc. EPAC'00, Vienna, Austria, Jun. 2000, paper THP6A06, pp. 824-826.
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References
- J. Shi, L. Jin, D. Wang, and F. Wang, “Beam-Beam Effects in the Ring-Ring Version of eRHIC”, in Proc. 21st Particle Accelerator Conf. (PAC'05), Knoxville, TN, USA, May 2005, paper TPPP017, pp. 1520-1522.
- D. G. Moore, O. Goudard, and L. Hardy, “j5 Logbook - A Commercial e-logbook”, in Proc. 7th Int. Workshop on Personal Computers and Particle Accelerator Controls (PCaPAC'08), Ljbuljana, Slovenia, Oct. 2008, paper TUX04, pp. 52-54.
- J. Fessenden, “Emittance Variations in Current-Amplifying Ion Induction Linacs”, in Proc. 14th Particle Accelerator Conf. (PAC'91), San Francisco, CA, USA, May 1991, pp. 586-591.
- M. A. K. Othman et al., “High-Gradient Tests of W-Band Accelerating Structures”, presented at the North American Particle Accelerator Conf. (NAPAC'19), Lansing, MI, USA, Sep. 2019, paper THYBB4, unpublished.
- T. Higo, R. M. Jones, R. H. Miller, T. O. Raubenheimer, G. V. Stupakov, and J. W. Wang, “The Influence of Fabrication Errors on the Wakefield and Emittance Growth for the Next Linear Collider”, in Proc. 7th European Particle Accelerator Conf. (EPAC'00), Vienna, Austria, Jun. 2000, paper THP6A06, pp. 824-826.
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