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[n]	K. R. Lauer, D. B. Allan, and T. A. Caswell, “caproto: An EPICS Channel Access Interface in Pure Python”, in Proc. ICALEPCS'19, New York, NY, USA, Oct. 2019, paper WESH4001, pp. XX-XX. 
[n]	V. Shevtsov, V. Aleksandrov, Y. Jongen, Yu. Kazarinov, and D. Vandeplassche, “Design Study of the Axial Injection System of C400 Cyclotron”, in Proc. EPAC'06, Edinburgh, UK, Jun. 2006, paper TUPLS119, pp. 1786-1788. 
[n]	R. Tom?ís et al., “Status of the CLIC Beam Delivery System”, in Proc. PAC'09, Vancouver, Canada, May 2009, paper WE6PFP023, pp. 2537-2539. 
[n]	E. Buratin and K. B. Scheidt, “New X-Rays Diagnostics at ESRF: The X-BPMs and the Halo-Monitor”, in Proc. IBIC'22, Kraków, Poland, Sep. 2022, pp. 125-128. doi:10.18429/JACoW-IBIC2022-MOP34
[n]	C. Tennant, D. Douglas, K. Jordan, L. Merminga, E. Pozdeyev, and T. I. Smith, “Suppression of Multipass, Multibunch Beam Breakup in Two Pass Recirculating Accelerators”, in Proc. FEL'04, Trieste, Italy, Aug.-Sep. 2004, paper WEBOS03, pp. XX-XX. 
[n]	B. Laun?® et al., “Diagnostic System Dedicated to the Radioactive Ion Beams at the SPIRAL Facility”, in Proc. Cyclotrons'98, Caen, France, Jun. 1998, paper B-03, pp. 163-166. 
[n]	R. Keller, “Tune-Split Effects at the ALS Storage Ring”, in Proc. PAC'97, Vancouver, Canada, May 1997, paper 6V009, pp. 787-789. 
[n]	M. Nishiwaki, K. Akai, T. Furuya, A. Kabe, S. Mitsunobu, and Y. Morita, “Developments of HOM Dampers for SuperKEKB Superconducting Cavity”, in Proc. SRF'13, Paris, France, Sep. 2013, paper THP061, pp. 1058-1060. 
[n]	Ph. Piot and K. Fl?Âttmann, “An Upgraded Injector for the TTF FEL-user Facility”, in Proc. EPAC'02, Paris, France, Jun. 2002, paper TUPRI051, pp. 1798-1800. 
[n]	V. Zubko, I. Bogdanov, S. Kozub, P. A. Shcherbakov, L. S. Shirshov, and L. Tkachenko, “Study of Electrodynamic and Thermodynamic Mechanisms Influencing Stability of Superconducting Rutherford Cable”, in Proc. RuPAC'10, Protvino, Russia, Sep.-Oct. 2010, paper THPSC007, pp. 337-339. 
[n]	R. Veness et al., “Design Aspects of the RF Contacts for the LHC Beam Vacuum Interconnects”, in Proc. PAC'01, Chicago, IL, USA, Jun. 2001, paper WPAH037, pp. 2168-2170. 

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