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[n]	J. Sauza-Bedolla et al., “Preserving Micron Tolerances Through the Assembly Process of an X-band Accelerating Structure”, in Proc. LINAC'18, Beijing, China, Sep. 2018, pp. 377-379. doi:10.18429/JACoW-LINAC2018-TUPO023

[n]	J. Li and G. Wei, “Design and Thermomechanical Calculation of High-heat-load Absorber in WALS Storage Ring”, presented at the IPAC'23, Venice, Italy, May 2023, paper THPM012, unpublished. 

For LaTeX

%\cite{Sauza-Bedolla:LINAC18-TUPO023} \bibitem{Sauza-Bedolla:LINAC18-TUPO023} J. Sauza-Bedolla \emph{et al.}, \textquotedblleft{Preserving Micron Tolerances Through the Assembly Process of an X-band Accelerating Structure}\textquotedblright, in \emph{Proc. LINAC’18}, Beijing, China, Sep. 2018, pp. 377--379. \doi{10.18429/JACoW-LINAC2018-TUPO023} %\cite{JLi:IPAC23-THPM012} \bibitem{JLi:IPAC23-THPM012} J. Li and G. Wei, \textquotedblleft{Design and Thermomechanical Calculation of High-heat-load Absorber in WALS Storage Ring}\textquotedblright, presented at the IPAC’23, Venice, Italy, May 2023, paper THPM012, unpublished.

For BibTeX

@inproceedings{sauza-bedolla:linac18-tupo023, author = {J. Sauza-Bedolla and others}, title = {{Preserving Micron Tolerances Through the Assembly Process of an X-band Accelerating Structure}}, booktitle = {Proc. LINAC'18}, pages = {377--379}, paper = {TUPO023}, venue = {Beijing, China}, series = {Linear Accelerator Conference}, number = {29}, publisher = {JACoW Publishing, Geneva, Switzerland}, month = {1}, year = {2019}, issn = {2226-0366}, isbn = {978-3-95-450194-6}, doi = {10.18429/JACoW-LINAC2018-TUPO023}, url = {https://jacow.org/linac2018/papers/TUPO023.pdf}, language = {english} } @unpublished{jli:ipac23-thpm012, author = {J. Li and G. Wei}, title = {{Design and Thermomechanical Calculation of High-heat-load Absorber in WALS Storage Ring}}, booktitle = {Proc. IPAC'23}, pages = {}, paper = {THPM012}, venue = {Venice, Italy}, intype = {presented at the}, series = {International Particle Accelerator Conference}, number = {14}, publisher = {JACoW Publishing, Geneva, Switzerland}, month = {9}, year = {2023}, issn = {2673-5490}, isbn = {978-3-95-450231-8}, note = {presented at IPAC'23, Venice, Italy, May 2023, paper THPM012, unpublished}, language = {english} }

References

• J. Sauza-Bedolla et al., “Preserving Micron Tolerances Through the Assembly Process of an X-band Accelerating Structure”, in Proc. 29th Linear Accelerator Conf. (LINAC'18), Beijing, China, Sep. 2018, pp. 377-379.
• J. Li and G. Wei, “Design and Thermomechanical Calculation of High-heat-load Absorber in WALS Storage Ring”, presented at the 14th Int. Particle Accelerator Conf. (IPAC'23), Venice, Italy, May 2023, paper THPM012, unpublished.