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[n]	E. Lee et al., “Lessons learned from hardware failure during HL-LHC AUP cabling”, in Proc. IPAC'24, Nashville, TN, USA, May 2024, pp. 2891-2894. doi:10.18429/JACoW-IPAC2024-WEPS80
[n]	A. Novokhatski and T. Weiland, “The Model of Ensembles for the Beam Dynamics Simulation”, in Proc. PAC'99, New York, NY, USA, Mar. 1999, paper THA58, pp. 2743-2745. 
[n]	A. A. Mikhailichenko, “Wiggler for ILC Cooler”, in Proc. EPAC'06, Edinburgh, UK, Jun. 2006, paper WEPLS064, pp. 2526-2528. 
[n]	M. Krishnan, S. F. Chapman, I. Irfan, K. M. Velas, J. K. Spradlin, and H. Tian, “Bulk Niobium Polishing and Electropolishing Steps for Thinfilm Coated Copper SRF Cavities”, in Proc. SRF'15, Whistler, Canada, Sep. 2015, paper TUPB034, pp. 633-637. 

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