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[n]	G. Turemen et al., “SPP Beamline Design and Beam Dynamics”, in Proc. IPAC'14, Dresden, Germany, Jun. 2014, pp. 3338-3341. doi:10.18429/JACoW-IPAC2014-THPME050

[n]	L. F. Wang, H. Fukuma, K. Ohmi, and Y. Suetsugu, “3D Simulation of Photoelectron Cloud”, in Proc. PAC'01, Chicago, IL, USA, Jun. 2001, paper FOAB010, pp. 701-703. 

For LaTeX

%\cite{Turemen:IPAC14-THPME050} \bibitem{Turemen:IPAC14-THPME050} G. Turemen \emph{et al.}, \textquotedblleft{SPP Beamline Design and Beam Dynamics}\textquotedblright, in \emph{Proc. IPAC’14}, Dresden, Germany, Jun. 2014, pp. 3338--3341. \doi{10.18429/JACoW-IPAC2014-THPME050} %\cite{Wang:PAC01-FOAB010} \bibitem{Wang:PAC01-FOAB010} L. F. Wang, H. Fukuma, K. Ohmi, and Y. Suetsugu, \textquotedblleft{3D Simulation of Photoelectron Cloud}\textquotedblright, in \emph{Proc. PAC’01}, Chicago, IL, USA, Jun. 2001, paper FOAB010, pp. 701--703.

For BibTeX

@inproceedings{turemen:ipac14-thpme050, author = {G. Turemen and others}, title = {{SPP Beamline Design and Beam Dynamics}}, booktitle = {Proc. IPAC'14}, pages = {3338--3341}, paper = {THPME050}, venue = {Dresden, Germany, Jun. 2014}, publisher = {JACoW Publishing, Geneva, Switzerland}, doi = {10.18429/JACoW-IPAC2014-THPME050}, url = {https://jacow.org/IPAC2014/papers/THPME050.pdf}, language = {english} } @inproceedings{wang:pac01-foab010, author = {L. F. Wang and H. Fukuma and K. Ohmi and Y. Suetsugu}, title = {{3D Simulation of Photoelectron Cloud}}, booktitle = {Proc. PAC'01}, pages = {701--703}, paper = {FOAB010}, venue = {Chicago, IL, USA, Jun. 2001}, publisher = {JACoW Publishing, Geneva, Switzerland}, url = {https://jacow.org/p01/papers/FOAB010.pdf}, language = {english} }

References

• G. Turemen et al., “SPP Beamline Design and Beam Dynamics”, in Proc. 5th Int. Particle Accelerator Conf. (IPAC'14), Dresden, Germany, Jun. 2014, pp. 3338-3341.
• L. F. Wang, H. Fukuma, K. Ohmi, and Y. Suetsugu, “3D Simulation of Photoelectron Cloud”, in Proc. 19th Particle Accelerator Conf. (PAC'01), Chicago, IL, USA, Jun. 2001, paper FOAB010, pp. 701-703.