Reference Search

Favourites

For Word

[n]	S. Jin et al., “Magnetic Shielding for the 1.3 GHz Cryomodule at IHEP”, in Proc. IPAC'13, Shanghai, China, May 2013, paper THPME010, pp. 3528-3530. 

[n]	M.-E. Couprie, “Possibilities for Future Synchrotron Radiation Sources”, in Proc. NAPAC'19, Lansing, MI, USA, Sep. 2019, pp. 1000-1006. doi:10.18429/JACoW-NAPAC2019-FRCHC2

For LaTeX

%\cite{Jin:IPAC13-THPME010} \bibitem{Jin:IPAC13-THPME010} S. Jin \emph{et al.}, \textquotedblleft{Magnetic Shielding for the 1.3 GHz Cryomodule at IHEP}\textquotedblright, in \emph{Proc. IPAC’13}, Shanghai, China, May 2013, paper THPME010, pp. 3528--3530. %\cite{M.-E:NAPAC19-FRCHC2} \bibitem{M.-E:NAPAC19-FRCHC2} M.-E. Couprie, \textquotedblleft{Possibilities for Future Synchrotron Radiation Sources}\textquotedblright, in \emph{Proc. NAPAC’19}, Lansing, MI, USA, Sep. 2019, pp. 1000--1006. \doi{10.18429/JACoW-NAPAC2019-FRCHC2}

For BibTeX

@inproceedings{jin:ipac13-thpme010, author = {S. Jin and others}, title = {{Magnetic Shielding for the 1.3 GHz Cryomodule at IHEP}}, booktitle = {Proc. IPAC'13}, pages = {3528--3530}, paper = {THPME010}, venue = {Shanghai, China, May 2013}, publisher = {JACoW Publishing, Geneva, Switzerland}, url = {https://jacow.org/IPAC2013/papers/THPME010.pdf}, language = {english} } @inproceedings{m.-e:napac19-frchc2, author = {M.-E. Couprie}, title = {{Possibilities for Future Synchrotron Radiation Sources}}, booktitle = {Proc. NAPAC'19}, pages = {1000--1006}, paper = {FRCHC2}, venue = {Lansing, MI, USA, Sep. 2019}, publisher = {JACoW Publishing, Geneva, Switzerland}, doi = {10.18429/JACoW-NAPAC2019-FRCHC2}, url = {https://jacow.org/napac2019/papers/FRCHC2.pdf}, language = {english} }

References

• S. Jin et al., “Magnetic Shielding for the 1.3 GHz Cryomodule at IHEP”, in Proc. 4th Int. Particle Accelerator Conf. (IPAC'13), Shanghai, China, May 2013, paper THPME010, pp. 3528-3530.
• M.-E. Couprie, “Possibilities for Future Synchrotron Radiation Sources”, in Proc. North American Particle Accelerator Conf. (NAPAC'19), Lansing, MI, USA, Sep. 2019, pp. 1000-1006.