[n] Y. Yamamoto, E. Kako, S. Michizono, E. Cenni, A. Four, and Y. Okii, “Recent Results for Study of Ceramic and Copper Plating for Power Couplers”, in Proc. LINAC'18, Beijing, China, Sep. 2018, pp. 905-907. doi:10.18429/JACoW-LINAC2018-THPO097
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Paper Title: Recent Results for Study of Ceramic and Copper Plating for Power Couplers
Paper URL: https://jacow.org/linac2018/papers/THPO097.pdf
Conference: 29th Linear Accelerator Conf. (LINAC'18)
Paper ID: THPO097
Location in proceedings: 905-907
Original Author String: Y. Yamamoto, E. Kako, S. Michizono [KEK, Ibaraki, Japan] E. Cenni [CEA/IRFU, Gif-sur-Yvette, France] A. Four [CEA/DRF/IRFU, Gif-sur-Yvette, France] Y. Okii [Nomura Plating Co, Ltd., Osaka, Japan]