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Author: Y. Okii


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Reference
Y. Yamamoto, E. Kako, S. Michizono, E. Cenni, A. Four, and Y. Okii, “Recent Results for Study of Ceramic and Copper Plating for Power Couplers”, in Proc. 29th Linear Accelerator Conf. (LINAC'18), Beijing, China, Sep. 2018, pp. 905-907.
Y. Okii et al., “R&D of Copper Electroplating Process for Power Couplers: Effect of Microstructures on RRR”, in Proc. 19th Int. Conf. RF Superconductivity (SRF'19), Dresden, Germany, Jun.-Jul. 2019, pp. 278-281.


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