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Reference

For Word

[n]	Y. Okii et al., “R&D of Copper Electroplating Process for Power Couplers: Effect of Microstructures on RRR”, in Proc. SRF'19, Dresden, Germany, Jun.-Jul. 2019, pp. 278-281. doi:10.18429/JACoW-SRF2019-MOP083

For LaTeX

%\cite{Okii:SRF19-MOP083} \bibitem{Okii:SRF19-MOP083} Y. Okii \emph{et al.}, \textquotedblleft{R&D of Copper Electroplating Process for Power Couplers: Effect of Microstructures on RRR}\textquotedblright, in \emph{Proc. SRF’19}, Dresden, Germany, Jun.-Jul. 2019, pp. 278--281. \url{doi:10.18429/JACoW-SRF2019-MOP083}

For BibTeX

@inproceedings{okii:srf19-mop083, author = {Y. Okii and others}, title = {{R&D of Copper Electroplating Process for Power Couplers: Effect of Microstructures on RRR}}, booktitle = {Proc. SRF'19}, pages = {278--281}, paper = {MOP083}, venue = {Dresden, Germany, Jun.-Jul. 2019}, publisher = {JACoW Publishing, Geneva, Switzerland}, doi = {10.18429/JACoW-SRF2019-MOP083}, url = {https://jacow.org/srf2019/papers/MOP083.pdf}, language = {english} }

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Metadata

Paper Title: R&D of Copper Electroplating Process for Power Couplers: Effect of Microstructures on RRR
Paper URL: https://jacow.org/srf2019/papers/MOP083.pdf
Conference: 19th Int. Conf. RF Superconductivity (SRF'19)
Paper ID: MOP083
Location in proceedings: 278-281
Original Author String: Y. Okii,E. Kako,S. Michizono,J. Taguchi,H. Takahashi,Y. Yamamoto,H. Yasutake

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