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Author: A. T. Wu


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Reference
A. T. Wu et al., “Surface Treatments of Nb by Buffered Electropolishing”, in Proc. 14th Int. Conf. RF Superconductivity (SRF'09), Berlin, Germany, Sep. 2009, paper THPPO064, pp. 755-759.
A. T. Wu et al., “Study of Low Temperature Baking Effect on Field Emission on Nb Samples Treated by BEP, EP, and BCP”, in Proc. 1st Int. Particle Accelerator Conf. (IPAC'10), Kyoto, Japan, May 2010, paper WEPEC081, pp. 3067-3069.
A. T. Wu et al., “Buffered Electropolishing ÔÇô A New Way for Achieving Extremely Smooth Surface Finish on Nb SRF Cavities to be Used in Particle Accelerators”, in Proc. 23rd Particle Accelerator Conf. (PAC'09), Vancouver, Canada, May 2009, paper WE5PFP060, pp. 2141-2143.
A. T. Wu et al., “Advance in Vertical Buffered Electropolishing on Niobium for Particle Accelerators”, in Proc. 2nd Int. Particle Accelerator Conf. (IPAC'11), San Sebastian, Spain, Sep. 2011, paper MOPC117, pp. 352-354.
A. T. Wu and D. R. Swenson, “Significant Reduction in Field Emission on Niobium Surfaces after GCIB Treatment”, in Proc. 14th Int. Conf. RF Superconductivity (SRF'09), Berlin, Germany, Sep. 2009, paper THPPO065, pp. 760-764.


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