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[n]	K. Nii et al., “Impact of Vertical Electropolishing with Flipping System on Removal Uniformity and Surface State: Study with 9-Cell Niobium Coupon Cavity”, in Proc. SRF'21, East Lansing, MI, USA, Jun.-Jul. 2021, pp. 783. doi:10.18429/JACoW-SRF2021-THPCAV003

For LaTeX

%\cite{Nii:SRF21-THPCAV003} \bibitem{Nii:SRF21-THPCAV003} K. Nii \emph{et al.}, \textquotedblleft{Impact of Vertical Electropolishing with Flipping System on Removal Uniformity and Surface State: Study with 9-Cell Niobium Coupon Cavity}\textquotedblright, in \emph{Proc. SRF’21}, East Lansing, MI, USA, Jun.-Jul. 2021, pp. 783. \doi{10.18429/JACoW-SRF2021-THPCAV003}

For BibTeX

@inproceedings{nii:srf21-thpcav003, author = {K. Nii and others}, title = {{Impact of Vertical Electropolishing with Flipping System on Removal Uniformity and Surface State: Study with 9-Cell Niobium Coupon Cavity}}, booktitle = {Proc. SRF'21}, pages = {783}, paper = {THPCAV003}, venue = {East Lansing, MI, USA}, series = {International Conference on RF Superconductivity}, number = {20}, publisher = {JACoW Publishing, Geneva, Switzerland}, month = {10}, year = {2022}, issn = {2673-5504}, isbn = {978-3-95-450233-2}, doi = {10.18429/JACoW-SRF2021-THPCAV003}, url = {https://jacow.org/srf2021/papers/THPCAV003.pdf}, language = {english} }

References

• K. Nii et al., “Impact of Vertical Electropolishing with Flipping System on Removal Uniformity and Surface State: Study with 9-Cell Niobium Coupon Cavity”, in Proc. 20th International Conference on RF Superconductivity (SRF'21), East Lansing, MI, USA, Jun.-Jul. 2021, pp. 783.