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[n]	M. Aicheler, “Thermal Fatigue of Polycrystalline Copper in CLIC Accelerating Structures: Surface Roughening and Hardening as a Function of Grain Orientation”, in Proc. LINAC'10, Tsukuba, Japan, Sep. 2010, paper MOP069, pp. 214-216. 
[n]	S.-D. Jang, S.-J. Park, and Y.-G. Son, “Test Lab Klystron-Modulator System for RF Components Performance Test  of PLS-II Linac”, presented at the IPAC'23, Venice, Italy, May 2023, paper MOPL142, unpublished. 

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