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[n]	C. Pira et al., “Progress of application and surface enhancement by Plasma Electrolytic Polishing as a new treatment for SRF substrates and accelerator components preparation”, presented at the IPAC'23, Venice, Italy, May 2023, paper THPM036, unpublished. 

[n]	G. Cheng, G. Ciovati, and M. L. Morrone, “Evaluation of Low Heat Conductivity RF Cables”, in Proc. SRF'19, Dresden, Germany, Jun.-Jul. 2019, pp. 1045-1049. doi:10.18429/JACoW-SRF2019-THP068

[n]	C. Compton et al., “Superconducting Resonator and Cryomodule Production for Ion Linacs at Michigan State University”, in Proc. LINAC'10, Tsukuba, Japan, Sep. 2010, paper THP040, pp. 848-850. 

[n]	O. Dolinskyy, Y. El Hayek, D. Ondreka, and P. Spiller, “Design and Performance Analysis of the Upgraded Transfer Line for Two-Plane Injection at the SIS18.”, presented at the IPAC'26, Deauville, France, May 2026, paper WEP5012, unpublished. 

[n]	I. C. Sheng, S. Sharma, J. Howell, and E. Rotela, “A Conceptual Design and Thermal Analysis of High Heat Load Crotch Absorber”, in Proc. PAC'93, Washington D.C., USA, Mar. 1993, pp. 1497-1500. 

[n]	C. Pira et al., “Progress in European Thin Film Activities”, in Proc. SRF'23, Grand Rapids, MI, USA, Jun. 2023, pp. 607-614. doi:10.18429/JACoW-SRF2023-WECAA01

For LaTeX

%\cite{Pira:IPAC23-THPM036} \bibitem{Pira:IPAC23-THPM036} C. Pira \emph{et al.}, \textquotedblleft{Progress of application and surface enhancement by Plasma Electrolytic Polishing as a new treatment for SRF substrates and accelerator components preparation}\textquotedblright, presented at the IPAC’23, Venice, Italy, May 2023, paper THPM036, unpublished. %\cite{Cheng:SRF19-THP068} \bibitem{Cheng:SRF19-THP068} G. Cheng, G. Ciovati, and M. L. Morrone, \textquotedblleft{Evaluation of Low Heat Conductivity RF Cables}\textquotedblright, in \emph{Proc. SRF’19}, Dresden, Germany, Jun.-Jul. 2019, pp. 1045--1049. \doi{10.18429/JACoW-SRF2019-THP068} %\cite{Compton:LINAC10-THP040} \bibitem{Compton:LINAC10-THP040} C. Compton \emph{et al.}, \textquotedblleft{Superconducting Resonator and Cryomodule Production for Ion Linacs at Michigan State University}\textquotedblright, in \emph{Proc. LINAC’10}, Tsukuba, Japan, Sep. 2010, paper THP040, pp. 848--850. %\cite{Dolinskyy:IPAC26-WEP5012} \bibitem{Dolinskyy:IPAC26-WEP5012} O. Dolinskyy, Y. El Hayek, D. Ondreka, and P. Spiller, \textquotedblleft{Design and Performance Analysis of the Upgraded Transfer Line for Two-Plane Injection at the SIS18.}\textquotedblright, presented at the IPAC’26, Deauville, France, May 2026, paper WEP5012, unpublished. %\cite{Sheng:PAC93} \bibitem{Sheng:PAC93} I. C. Sheng, S. Sharma, J. Howell, and E. Rotela, \textquotedblleft{A Conceptual Design and Thermal Analysis of High Heat Load Crotch Absorber}\textquotedblright, in \emph{Proc. PAC’93}, Washington D.C., USA, Mar. 1993, pp. 1497--1500. %\cite{Pira:SRF23-WECAA01} \bibitem{Pira:SRF23-WECAA01} C. Pira \emph{et al.}, \textquotedblleft{Progress in European Thin Film Activities}\textquotedblright, in \emph{Proc. SRF’23}, Grand Rapids, MI, USA, Jun. 2023, pp. 607--614. \doi{10.18429/JACoW-SRF2023-WECAA01}

For BibTeX

@unpublished{pira:ipac23-thpm036, author = {C. Pira and others}, title = {{Progress of application and surface enhancement by Plasma Electrolytic Polishing as a new treatment for SRF substrates and accelerator components preparation}}, booktitle = {Proc. IPAC'23}, pages = {}, paper = {THPM036}, venue = {Venice, Italy}, intype = {presented at the}, series = {International Particle Accelerator Conference}, number = {14}, publisher = {JACoW Publishing, Geneva, Switzerland}, month = {9}, year = {2023}, issn = {2673-5490}, isbn = {978-3-95-450231-8}, note = {presented at IPAC'23, Venice, Italy, May 2023, paper THPM036, unpublished}, language = {english} } @inproceedings{cheng:srf19-thp068, author = {G. Cheng and G. Ciovati and M. L. Morrone}, title = {{Evaluation of Low Heat Conductivity RF Cables}}, booktitle = {Proc. SRF'19}, pages = {1045--1049}, paper = {THP068}, venue = {Dresden, Germany, Jun.-Jul. 2019}, publisher = {JACoW Publishing, Geneva, Switzerland}, doi = {10.18429/JACoW-SRF2019-THP068}, url = {https://jacow.org/srf2019/papers/THP068.pdf}, language = {english} } @inproceedings{compton:linac10-thp040, author = {C. Compton and others}, title = {{Superconducting Resonator and Cryomodule Production for Ion Linacs at Michigan State University}}, booktitle = {Proc. LINAC'10}, pages = {848--850}, paper = {THP040}, venue = {Tsukuba, Japan, Sep. 2010}, series = {Linear Accelerator Conference}, number = {25}, publisher = {JACoW Publishing, Geneva, Switzerland}, url = {https://jacow.org/LINAC2010/papers/THP040.pdf}, language = {english} } @unpublished{dolinskyy:ipac26-wep5012, author = {O. Dolinskyy and Y. El Hayek and D. Ondreka and P. Spiller}, title = {{Design and Performance Analysis of the Upgraded Transfer Line for Two-Plane Injection at the SIS18.}}, pages = {}, paper = {WEP5012}, venue = {Deauville, France, May 2026}, intype = {presented at the}, series = {International Particle Accelerator Conference}, number = {16}, publisher = {JACoW Publishing, Geneva, Switzerland}, note = {presented at IPAC'26, Deauville, France, May 2026, paper WEP5012, unpublished}, language = {english} } @inproceedings{sheng:pac93, author = {I. C. Sheng and S. Sharma and J. Howell and E. Rotela}, title = {{A Conceptual Design and Thermal Analysis of High Heat Load Crotch Absorber}}, booktitle = {Proc. PAC'93}, pages = {1497--1500}, paper = {}, venue = {Washington D.C., USA, Mar. 1993}, publisher = {JACoW Publishing, Geneva, Switzerland}, language = {english} } @inproceedings{pira:srf23-wecaa01, author = {C. Pira and others}, title = {{Progress in European Thin Film Activities}}, booktitle = {Proc. SRF'23}, pages = {607--614}, paper = {WECAA01}, venue = {Grand Rapids, MI, USA}, series = {International Conference on RF Superconductivity}, number = {21}, publisher = {JACoW Publishing, Geneva, Switzerland}, month = {8}, year = {2023}, issn = {2673-5504}, isbn = {978-3-95-450234-9}, doi = {10.18429/JACoW-SRF2023-WECAA01}, language = {english} }

References

• C. Pira et al., “Progress of application and surface enhancement by Plasma Electrolytic Polishing as a new treatment for SRF substrates and accelerator components preparation”, presented at the 14th Int. Particle Accelerator Conf. (IPAC'23), Venice, Italy, May 2023, paper THPM036, unpublished.
• G. Cheng, G. Ciovati, and M. L. Morrone, “Evaluation of Low Heat Conductivity RF Cables”, in Proc. 19th Int. Conf. RF Superconductivity (SRF'19), Dresden, Germany, Jun.-Jul. 2019, pp. 1045-1049.
• C. Compton et al., “Superconducting Resonator and Cryomodule Production for Ion Linacs at Michigan State University”, in Proc. 25th Linear Accelerator Conf. (LINAC'10), Tsukuba, Japan, Sep. 2010, paper THP040, pp. 848-850.
• O. Dolinskyy, Y. El Hayek, D. Ondreka, and P. Spiller, “Design and Performance Analysis of the Upgraded Transfer Line for Two-Plane Injection at the SIS18.”, presented at the 17th Int. Particle Accelerator Conf. (IPAC'26), Deauville, France, May 2026, paper WEP5012, this conference.
• I. C. Sheng, S. Sharma, J. Howell, and E. Rotela, “A Conceptual Design and Thermal Analysis of High Heat Load Crotch Absorber”, in Proc. 15th Particle Accelerator Conf. (PAC'93), Washington D.C., USA, Mar. 1993, pp. 1497-1500.
• C. Pira et al., “Progress in European Thin Film Activities”, in Proc. 21th Int. Conf. RF Superconductivity (SRF'23), Grand Rapids, MI, USA, Jun. 2023, paper WECAA01, pp. 607-614.