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[n]	L. Zhao, G. Cheng, G. Ciovati, and K. M. Wilson, “Copper Plating Qualification Process for the Fundamental Power Coupler Waveguides for CEBAF Cryomodules”, in Proc. SRF'23, Grand Rapids, MI, USA, Jun. 2023, pp. 790-793. doi:10.18429/JACoW-SRF2023-WEPWB087

For LaTeX

%\cite{Zhao:SRF23-WEPWB087} \bibitem{Zhao:SRF23-WEPWB087} L. Zhao, G. Cheng, G. Ciovati, and K. M. Wilson, \textquotedblleft{Copper Plating Qualification Process for the Fundamental Power Coupler Waveguides for CEBAF Cryomodules}\textquotedblright, in \emph{Proc. SRF’23}, Grand Rapids, MI, USA, Jun. 2023, pp. 790--793. \url{doi:10.18429/JACoW-SRF2023-WEPWB087}

For BibTeX

@inproceedings{zhao:srf23-wepwb087, author = {L. Zhao and G. Cheng and G. Ciovati and K. M. Wilson}, title = {{Copper Plating Qualification Process for the Fundamental Power Coupler Waveguides for CEBAF Cryomodules}}, booktitle = {Proc. SRF'23}, pages = {790--793}, paper = {WEPWB087}, venue = {Grand Rapids, MI, USA}, series = {International Conference on RF Superconductivity}, number = {21}, publisher = {JACoW Publishing, Geneva, Switzerland}, month = {8}, year = {2023}, issn = {2673-5504}, isbn = {978-3-95-450234-9}, doi = {10.18429/JACoW-SRF2023-WEPWB087}, language = {english} }

References

• L. Zhao, G. Cheng, G. Ciovati, and K. M. Wilson, “Copper Plating Qualification Process for the Fundamental Power Coupler Waveguides for CEBAF Cryomodules”, in Proc. 21th Int. Conf. RF Superconductivity (SRF'23), Grand Rapids, MI, USA, Jun. 2023, paper WEPWB087, pp. 790-793.