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[n]	J. Storch, E. Boos, K. Kümpel, and H. Podlech, “Material properies of 3D-printed copper for rf-cavities”, in Proc. IPAC'25, Taipei, Taiwan, Jun. 2025, pp. 2673-2676. doi:10.18429/JACoW-IPAC2025-THPB097

For LaTeX

%\cite{Storch:IPAC25-THPB097} \bibitem{Storch:IPAC25-THPB097} J. Storch, E. Boos, K. Kümpel, and H. Podlech, \textquotedblleft{Material properies of 3D-printed copper for rf-cavities}\textquotedblright, in \emph{Proc. IPAC’25}, Taipei, Taiwan, Jun. 2025, pp. 2673--2676. \doi{10.18429/JACoW-IPAC2025-THPB097}

For BibTeX

@inproceedings{storch:ipac25-thpb097, author = {J. Storch and E. Boos and K. Kümpel and H. Podlech}, title = {{Material properies of 3D-printed copper for rf-cavities}}, booktitle = {Proc. IPAC'25}, pages = {2673--2676}, paper = {THPB097}, venue = {Taipei, Taiwan}, series = {International Particle Accelerator Conference}, number = {16}, publisher = {JACoW Publishing, Geneva, Switzerland}, month = {11}, year = {2025}, issn = {2673-5490}, isbn = {978-3-95-450248-6}, doi = {10.18429/JACoW-IPAC2025-THPB097}, language = {english} }

References

• J. Storch, E. Boos, K. Kümpel, and H. Podlech, “Material properies of 3D-printed copper for rf-cavities”, in Proc. 16th Int. Particle Accelerator Conf. (IPAC'25), Taipei, Taiwan, Jun. 2025, paper THPB097, pp. 2673-2676.