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[n]	J. Storch, E. Boos, K. Kümpel, and H. Podlech, “Material properies of 3D-printed copper for rf-cavities”, presented at the IPAC'25, Taipei, Taiwan, Jun. 2025, paper THPB097, unpublished. 

For LaTeX

%\cite{Storch:IPAC25-THPB097} \bibitem{Storch:IPAC25-THPB097} J. Storch, E. Boos, K. Kümpel, and H. Podlech, \textquotedblleft{Material properies of 3D-printed copper for rf-cavities}\textquotedblright, presented at the IPAC’25, Taipei, Taiwan, Jun. 2025, paper THPB097, unpublished.

For BibTeX

@unpublished{storch:ipac25-thpb097, author = {J. Storch and E. Boos and K. Kümpel and H. Podlech}, title = {{Material properies of 3D-printed copper for rf-cavities}}, pages = {}, paper = {THPB097}, venue = {Taipei, Taiwan, Jun. 2025}, intype = {presented at the}, series = {International Particle Accelerator Conference}, number = {16}, publisher = {JACoW Publishing, Geneva, Switzerland}, note = {presented at IPAC'25, Taipei, Taiwan, Jun. 2025, paper THPB097, unpublished}, language = {english} }

References

• J. Storch, E. Boos, K. Kümpel, and H. Podlech, “Material properies of 3D-printed copper for rf-cavities”, presented at the 16th Int. Particle Accelerator Conf. (IPAC'25), Taipei, Taiwan, Jun. 2025, paper THPB097, this conference.