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[n]	L. Sabato, G. Iadarola, L. Mether, T. Pieloni, and M. Zobov, “Filling pattern with non-uniform bunch spacing to mitigate e-cloud for the FCC-ee”, in Proc. IPAC'25, Taipei, Taiwan, Jun. 2025, pp. 2358-2361. doi:10.18429/JACoW-IPAC2025-WEPS051

[n]	J. Storch, E. Boos, K. Kümpel, and H. Podlech, “Material properies of 3D-printed copper for rf-cavities”, in Proc. IPAC'25, Taipei, Taiwan, Jun. 2025, pp. 2673-2676. doi:10.18429/JACoW-IPAC2025-THPB097

For LaTeX

%\cite{Sabato:IPAC25-WEPS051} \bibitem{Sabato:IPAC25-WEPS051} L. Sabato, G. Iadarola, L. Mether, T. Pieloni, and M. Zobov, \textquotedblleft{Filling pattern with non-uniform bunch spacing to mitigate e-cloud for the FCC-ee}\textquotedblright, in \emph{Proc. IPAC’25}, Taipei, Taiwan, Jun. 2025, pp. 2358--2361. \doi{10.18429/JACoW-IPAC2025-WEPS051} %\cite{Storch:IPAC25-THPB097} \bibitem{Storch:IPAC25-THPB097} J. Storch, E. Boos, K. Kümpel, and H. Podlech, \textquotedblleft{Material properies of 3D-printed copper for rf-cavities}\textquotedblright, in \emph{Proc. IPAC’25}, Taipei, Taiwan, Jun. 2025, pp. 2673--2676. \doi{10.18429/JACoW-IPAC2025-THPB097}

For BibTeX

@inproceedings{sabato:ipac25-weps051, author = {L. Sabato and G. Iadarola and L. Mether and T. Pieloni and M. Zobov}, title = {{Filling pattern with non-uniform bunch spacing to mitigate e-cloud for the FCC-ee}}, booktitle = {Proc. IPAC'25}, pages = {2358--2361}, paper = {WEPS051}, venue = {Taipei, Taiwan}, series = {International Particle Accelerator Conference}, number = {16}, publisher = {JACoW Publishing, Geneva, Switzerland}, month = {11}, year = {2025}, issn = {2673-5490}, isbn = {978-3-95-450248-6}, doi = {10.18429/JACoW-IPAC2025-WEPS051}, language = {english} } @inproceedings{storch:ipac25-thpb097, author = {J. Storch and E. Boos and K. Kümpel and H. Podlech}, title = {{Material properies of 3D-printed copper for rf-cavities}}, booktitle = {Proc. IPAC'25}, pages = {2673--2676}, paper = {THPB097}, venue = {Taipei, Taiwan}, series = {International Particle Accelerator Conference}, number = {16}, publisher = {JACoW Publishing, Geneva, Switzerland}, month = {11}, year = {2025}, issn = {2673-5490}, isbn = {978-3-95-450248-6}, doi = {10.18429/JACoW-IPAC2025-THPB097}, language = {english} }

References

• L. Sabato, G. Iadarola, L. Mether, T. Pieloni, and M. Zobov, “Filling pattern with non-uniform bunch spacing to mitigate e-cloud for the FCC-ee”, in Proc. 16th Int. Particle Accelerator Conf. (IPAC'25), Taipei, Taiwan, Jun. 2025, paper WEPS051, pp. 2358-2361.
• J. Storch, E. Boos, K. Kümpel, and H. Podlech, “Material properies of 3D-printed copper for rf-cavities”, in Proc. 16th Int. Particle Accelerator Conf. (IPAC'25), Taipei, Taiwan, Jun. 2025, paper THPB097, pp. 2673-2676.