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[n]	E. Lee et al., “Lessons learned from hardware failure during HL-LHC AUP cabling”, in Proc. IPAC'24, Nashville, TN, USA, May 2024, pp. 2891-2894. doi:10.18429/JACoW-IPAC2024-WEPS80

[n]	A. Novokhatski and T. Weiland, “The Model of Ensembles for the Beam Dynamics Simulation”, in Proc. PAC'99, New York, NY, USA, Mar. 1999, paper THA58, pp. 2743-2745. 

[n]	A. A. Mikhailichenko, “Wiggler for ILC Cooler”, in Proc. EPAC'06, Edinburgh, UK, Jun. 2006, paper WEPLS064, pp. 2526-2528. 

[n]	M. Krishnan, S. F. Chapman, I. Irfan, K. M. Velas, J. K. Spradlin, and H. Tian, “Bulk Niobium Polishing and Electropolishing Steps for Thinfilm Coated Copper SRF Cavities”, in Proc. SRF'15, Whistler, Canada, Sep. 2015, paper TUPB034, pp. 633-637. 

[n]	I. Karaaslan, K. DiPetrillo, D. Neuffer, D. Stratakis, and K. Yonehara, “Dispersion suppression for wedge-based final cooling at a 10 TeV Muon Collider”, presented at the IPAC'26, Deauville, France, May 2026, paper WEP1345, unpublished. 

[n]	A. Blednykh et al., “An Overview of the Collective Effects and Impedance Calculation for the EIC”, in Proc. IPAC'21, Campinas, Brazil, May 2021, pp. 4266-4269. doi:10.18429/JACoW-IPAC2021-THPAB238

For LaTeX

%\cite{Lee:IPAC24-WEPS80} \bibitem{Lee:IPAC24-WEPS80} E. Lee \emph{et al.}, \textquotedblleft{Lessons learned from hardware failure during HL-LHC AUP cabling}\textquotedblright, in \emph{Proc. IPAC’24}, Nashville, TN, USA, May 2024, pp. 2891--2894. \doi{10.18429/JACoW-IPAC2024-WEPS80} %\cite{Novokhatski:PAC99-THA58} \bibitem{Novokhatski:PAC99-THA58} A. Novokhatski and T. Weiland, \textquotedblleft{The Model of Ensembles for the Beam Dynamics Simulation}\textquotedblright, in \emph{Proc. PAC’99}, New York, NY, USA, Mar. 1999, paper THA58, pp. 2743--2745. %\cite{Mikhailichenko:EPAC06-WEPLS064} \bibitem{Mikhailichenko:EPAC06-WEPLS064} A. A. Mikhailichenko, \textquotedblleft{Wiggler for ILC Cooler}\textquotedblright, in \emph{Proc. EPAC’06}, Edinburgh, UK, Jun. 2006, paper WEPLS064, pp. 2526--2528. %\cite{Krishnan:SRF15-TUPB034} \bibitem{Krishnan:SRF15-TUPB034} M. Krishnan, S. F. Chapman, I. Irfan, K. M. Velas, J. K. Spradlin, and H. Tian, \textquotedblleft{Bulk Niobium Polishing and Electropolishing Steps for Thinfilm Coated Copper SRF Cavities}\textquotedblright, in \emph{Proc. SRF’15}, Whistler, Canada, Sep. 2015, paper TUPB034, pp. 633--637. %\cite{Karaaslan:IPAC26-WEP1345} \bibitem{Karaaslan:IPAC26-WEP1345} I. Karaaslan, K. DiPetrillo, D. Neuffer, D. Stratakis, and K. Yonehara, \textquotedblleft{Dispersion suppression for wedge-based final cooling at a 10 TeV Muon Collider}\textquotedblright, presented at the IPAC’26, Deauville, France, May 2026, paper WEP1345, unpublished. %\cite{Blednykh:IPAC21-THPAB238} \bibitem{Blednykh:IPAC21-THPAB238} A. Blednykh \emph{et al.}, \textquotedblleft{An Overview of the Collective Effects and Impedance Calculation for the EIC}\textquotedblright, in \emph{Proc. IPAC’21}, Campinas, Brazil, May 2021, pp. 4266--4269. \doi{10.18429/JACoW-IPAC2021-THPAB238}

For BibTeX

@inproceedings{lee:ipac24-weps80, author = {E. Lee and others}, title = {{Lessons learned from hardware failure during HL-LHC AUP cabling}}, booktitle = {Proc. IPAC'24}, pages = {2891--2894}, paper = {WEPS80}, venue = {Nashville, TN, USA}, series = {International Particle Accelerator Conference}, number = {15}, publisher = {JACoW Publishing, Geneva, Switzerland}, month = {7}, year = {2024}, issn = {2673-5490}, isbn = {978-3-95-450247-9}, doi = {10.18429/JACoW-IPAC2024-WEPS80}, language = {english} } @inproceedings{novokhatski:pac99-tha58, author = {A. Novokhatski and T. Weiland}, title = {{The Model of Ensembles for the Beam Dynamics Simulation}}, booktitle = {Proc. PAC'99}, pages = {2743--2745}, paper = {THA58}, venue = {New York, NY, USA, Mar. 1999}, publisher = {JACoW Publishing, Geneva, Switzerland}, url = {https://jacow.org/p99/papers/THA58.pdf}, language = {english} } @inproceedings{mikhailichenko:epac06-wepls064, author = {A. A. Mikhailichenko}, title = {{Wiggler for ILC Cooler}}, booktitle = {Proc. EPAC'06}, pages = {2526--2528}, paper = {WEPLS064}, venue = {Edinburgh, UK}, series = {European Particle Accelerator Conference}, number = {10}, publisher = {JACoW Publishing, Geneva, Switzerland}, month = {7}, year = {2006}, language = {english} } @inproceedings{krishnan:srf15-tupb034, author = {M. Krishnan and S. F. Chapman and I. Irfan and K. M. Velas and J. K. Spradlin and H. Tian}, title = {{Bulk Niobium Polishing and Electropolishing Steps for Thinfilm Coated Copper SRF Cavities}}, booktitle = {Proc. SRF'15}, pages = {633--637}, paper = {TUPB034}, venue = {Whistler, Canada, Sep. 2015}, publisher = {JACoW Publishing, Geneva, Switzerland}, url = {https://jacow.org/SRF2015/papers/TUPB034.pdf}, language = {english} } @unpublished{karaaslan:ipac26-wep1345, author = {I. Karaaslan and K. DiPetrillo and D. Neuffer and D. Stratakis and K. Yonehara}, title = {{Dispersion suppression for wedge-based final cooling at a 10 TeV Muon Collider}}, pages = {}, paper = {WEP1345}, venue = {Deauville, France, May 2026}, intype = {presented at the}, series = {International Particle Accelerator Conference}, number = {16}, publisher = {JACoW Publishing, Geneva, Switzerland}, note = {presented at IPAC'26, Deauville, France, May 2026, paper WEP1345, unpublished}, language = {english} } @inproceedings{blednykh:ipac21-thpab238, author = {A. Blednykh and others}, title = {{An Overview of the Collective Effects and Impedance Calculation for the EIC}}, booktitle = {Proc. IPAC'21}, pages = {4266--4269}, paper = {THPAB238}, venue = {Campinas, Brazil, May 2021}, publisher = {JACoW Publishing, Geneva, Switzerland}, doi = {10.18429/JACoW-IPAC2021-THPAB238}, url = {https://jacow.org/ipac2021/papers/THPAB238.pdf}, language = {english} }

References

• E. Lee et al., “Lessons learned from hardware failure during HL-LHC AUP cabling”, in Proc. 15th Int. Particle Accelerator Conf. (IPAC'24), Nashville, TN, USA, May 2024, paper WEPS80, pp. 2891-2894.
• A. Novokhatski and T. Weiland, “The Model of Ensembles for the Beam Dynamics Simulation”, in Proc. 18th Particle Accelerator Conf. (PAC'99), New York, NY, USA, Mar. 1999, paper THA58, pp. 2743-2745.
• A. A. Mikhailichenko, “Wiggler for ILC Cooler”, in Proc. 10th European Particle Accelerator Conf. (EPAC'06), Edinburgh, UK, Jun. 2006, paper WEPLS064, pp. 2526-2528.
• M. Krishnan, S. F. Chapman, I. Irfan, K. M. Velas, J. K. Spradlin, and H. Tian, “Bulk Niobium Polishing and Electropolishing Steps for Thinfilm Coated Copper SRF Cavities”, in Proc. 17th Int. Conf. RF Superconductivity (SRF'15), Whistler, Canada, Sep. 2015, paper TUPB034, pp. 633-637.
• I. Karaaslan, K. DiPetrillo, D. Neuffer, D. Stratakis, and K. Yonehara, “Dispersion suppression for wedge-based final cooling at a 10 TeV Muon Collider”, presented at the 17th Int. Particle Accelerator Conf. (IPAC'26), Deauville, France, May 2026, paper WEP1345, this conference.
• A. Blednykh et al., “An Overview of the Collective Effects and Impedance Calculation for the EIC”, in Proc. 12th Int. Particle Accelerator Conf. (IPAC'21), Campinas, Brazil, May 2021, pp. 4266-4269.