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[n] R. Zennaro et al., “C-Band Accelerating Structure Development and Tests for the SwissFEL”, in Proc. LINAC'12, Tel Aviv, Israel, Sep. 2012, paper TUPB009, pp. 492-494.
[n] I. L. Sheynman, S. Baturin, and A. Kanareykin, “Analysis of a Rectangular Dielectric-lined Accelerating Structure with an Anisotropic Loading”, in Proc. IPAC'12, New Orleans, LA, USA, May 2012, paper WEPPP022, pp. 2769-2771.
[n] J. Sekutowicz, K. Beard, P. Kneisel, C. Thomas, G. Wu, and S. Zheng, “Superstructures for High Current FEL Application”, in Proc. PAC'03, Portland, OR, USA, May 2003, paper TPPE013, pp. 1575-1577.
[n] K. Bertsche and J. Palkovic, “Beam Profile Measurement in the Presence of Noise”, in Proc. PAC'95, Dallas, TX, USA, May 1995, paper TPB19, pp. 2572-2573.
[n] P. N. Juranic et al., “THz Streak Camera for FELTemporal Diagnostics: Concepts and Considerations”, in Proc. FEL'14, Basel, Switzerland, Aug. 2014, paper THA01, pp. 640-643.
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References
- R. Zennaro et al., “C-Band Accelerating Structure Development and Tests for the SwissFEL”, in Proc. 26th Linear Accelerator Conf. (LINAC'12), Tel Aviv, Israel, Sep. 2012, paper TUPB009, pp. 492-494.
- I. L. Sheynman, S. Baturin, and A. Kanareykin, “Analysis of a Rectangular Dielectric-lined Accelerating Structure with an Anisotropic Loading”, in Proc. 3rd Int. Particle Accelerator Conf. (IPAC'12), New Orleans, LA, USA, May 2012, paper WEPPP022, pp. 2769-2771.
- J. Sekutowicz, K. Beard, P. Kneisel, C. Thomas, G. Wu, and S. Zheng, “Superstructures for High Current FEL Application”, in Proc. 20th Particle Accelerator Conf. (PAC'03), Portland, OR, USA, May 2003, paper TPPE013, pp. 1575-1577.
- K. Bertsche and J. Palkovic, “Beam Profile Measurement in the Presence of Noise”, in Proc. 16th Particle Accelerator Conf. (PAC'95), Dallas, TX, USA, May 1995, paper TPB19, pp. 2572-2573.
- P. N. Juranic et al., “THz Streak Camera for FELTemporal Diagnostics: Concepts and Considerations”, in Proc. 36th Int. Free Electron Laser Conf. (FEL'14), Basel, Switzerland, Aug. 2014, paper THA01, pp. 640-643.
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